Chemical vapor deposition of ZrxTi1−xO2 and HfxTi1−xO2 thin films using the composite anhydrous nitrate precursors

Abstract Zr–Ti and Hf–Ti composite nitrates were successfully developed as single-source precursors for the chemical vapor deposition (CVD) of ZrxTi1−xO2 and HfxTi1−xO2 thin films. The Zr–Ti nitrate can be assumed as a solid solution of the individual Zr and Ti nitrates, and the Zr/Ti molar ratio in the deposited ZrxTi1−xO2 films is consistent with that in the precursor. The Hf–Ti nitrate appears to be a mixture of the Hf and Ti nitrates and the composition of the deposited HfxTi1−xO2 films depends remarkably on the heating time of precursor. Both ZrxTi1−xO2 and HfxTi1−xO2 films exhibit trade-off properties between band gap and dielectric constant. The obtained results suggest that ZrxTi1−xO2 and HfxTi1−xO2 films are promising candidates for gate dielectric application to improve the scalability and reduce the leakage current of the future complementary metal-oxide-semiconductor (CMOS) devices.