journal article·2026-06-01Open access

Investigation on α-particle-induced single event effects in AlGaN/GaN HEMTs: Bias, strike location, and trap effects

Soomin Kim, Hanggyo Jung, Jong-Min Lee, Jong Yul Park, Junhyung Jeong, Dong-Min Kang, Jongwook Jeon

AIP Advances· Volume 16· Issue 6

Abstract

This study first detailed simulation-based α-particle-induced effects in AlGaN/gallium nitride (GaN) high electron mobility transistors (HEMTs), with a specific focus on the correlation between gate/drain transient currents and trap behaviors. We quantitatively analyzed single-event effects (SEE) responses under varying gate/drain biases, ion strike locations, and trap types/densities to investigate the device’s SEE sensitivity and charge collection mechanisms. The results show that radiation sensitivity depends heavily on these conditions, with the device being particularly vulnerable in the OFF-state. In particular, drain transient current was most sensitive to strikes at the gate–drain edge, while gate current peaked at the gate center. To mitigate these effects, field-plate architecture was introduced to effectively redistribute peak electric fields, thereby providing a robust design guideline for improving the radiation tolerance of GaN HEMTs. Crucially, acceptor traps at the AlGaN/GaN interface were identified as the governing factor. Trapped electrons distort the local electric field, inducing band bending and activating the gate leakage mechanism. These results provide a comprehensive analysis of alpha particle-induced effects in AlGaN/GaN HEMTs, focusing on gate leakage and trap dynamics, addressing a gap in prior research. These results offer essential insights and establish a theoretical foundation for radiation-hardened device design.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Radiation Effects in Electronics · GaN-based semiconductor devices and materials · Advancements in Semiconductor Devices and Circuit Design

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Display Engineering, Sungkyunkwan University 1 , Suwon 16419,

Department of Semiconductor Convergence Engineering, Sungkyunkwan University 2 , Suwon 16419,

RF/Power Components Research Section, Electronics and Telecommunications Research Institute (ETRI) 3 , Daejeon, South Korea

Department of Electrical and Computer Engineering, Sungkyunkwan University 4 , Suwon 16419,

Funding

National Research Council of Science and Technology · Samsung

References (66)

Show source-provided references
1. AlGaN/GaN HEMTs—An overview of device operation and applications10.1109/jproc.2002.1021567 ↗
2. Very-high power density AlGaN/GaN HEMTs10.1109/16.906455 ↗
3. High-performance enhancement-mode AlGaN/GaN HEMTs using fluoride-based plasma treatment10.1109/led.2005.851122 ↗
4. Observations of two-dimensional electron gases in AlGaN/GaN high-electron-mobility transistors using up-converted photoluminescence excitation10.1364/OE.533392 ↗
5. High breakdown voltage in AlGaN/GaN HEMTs using AlGaN/GaN/AlGaN quantum-well electron-blocking layers10.1186/1556-276X-9-433 ↗
6. Enhancement-mode AlGaN/AlN/GaN high electron mobility transistor with low on-state resistance and high breakdown voltage10.1143/JJAP.45.L1168 ↗
7. Challenges and opportunities for high-power and high-frequency AlGaN/GaN high-electron-mobility transistor (HEMT) applications: A review10.3390/mi13122133 ↗
8. A compact temperature sensor with a resolution FoM of 1.82 pJ· K 210.1109/TIM.2020.2992839 ↗
9. Review—Ionizing radiation damage effects on GaN devices10.1149/2.0251602jss ↗
10. Semiconductor Industry Association, “Executive report,” in International Technology Roadmap for Semiconductors 2.0, 2015 Edition, 2.0 (Semiconductor Industry Association, 2015).
11. Compendium of total ionizing dose and displacement damage results from NASA/GSFC
12. A comprehensive investigation of total ionizing dose effects on bulk FinFETs through TCAD simulation10.1016/j.microrel.2024.115534 ↗
13. Radiation effects on microelectronics in space10.1109/5.90114 ↗
14. Effects of total-ionizing-dose irradiation on single-event burnout for commercial enhancement-mode AlGaN/GaN high-electron mobility transistors10.1088/0256-307X/37/4/046101 ↗
15. 10.1007/978-3-319-48764-9_22010.1007/978-3-319-48764-9_220 ↗
16. Total-ionizing-dose radiation effects in AlGaN/GaN HEMTs and MOS-HEMTs10.1109/TNS.2013.2278314 ↗
17. Radiation effects in AlGaN/GaN HEMTs10.1109/TNS.2022.3147143 ↗
18. Study on single event effects of enhanced GaN HEMT devices under various conditions10.3390/mi15080950 ↗
19. Basic mechanisms and modeling of single-event upset in digital circuits10.1109/tns.2003.813129 ↗
20. Single-event transient in FinFETs and nanosheet FETs10.1109/led.2018.2877882 ↗
21. Study of single event effect failure mechanism in P-GaN HEMTs based on experimental and TCAD simulation10.1016/j.radphyschem.2025.112698 ↗
22. Examination of trapping effects on single-event transients in GaN HEMTs10.1109/TNS.2022.3220235 ↗
23. Failure mechanisms of AlGaN/GaN HEMTs irradiated by high-energy heavy ions with and without bias10.1007/s41365-024-01567-2 ↗
24. TCAD simulation of the effect of buffer layer parameters on single event burn-out in p-GaN gate HEMTs10.1109/ted.2024.3403085 ↗
25. Experimental study of single event effects induced by heavy ion irradiation in enhancement mode GaN power HEMT10.1016/j.microrel.2015.06.139 ↗
26. Enhanced charge collection by single ion strike in AlGaN/GaN HEMTs10.1109/tns.2013.2289373 ↗
27. Electronics reliability assessment of future power fusion machines: Neutron interaction analysis in bulk silicon10.1016/j.microrel.2021.114223 ↗
28. Thermal performance enhancement of complementary field-effect transistors via comparative analysis of power delivery structures10.1063/5.0288728 ↗
29. Radiation effects on multi-channel Forksheet-FET and nanosheet-FET considering the bottom dielectric isolation scheme10.1016/j.net.2024.06.031 ↗
30. Simulation of single-event transient effect for GaN high-electron-mobility transistor10.3390/mi14101948 ↗
31. TCAD simulation of the single event effects in normally-OFF GaN transistors after heavy ion radiation10.1109/TNS.2017.2710629 ↗
32. Trap characterization techniques for GaN-based HEMTs: A critical review10.3390/mi14112044 ↗
33. A quantitative approach for trap analysis between Al0.25Ga0.75N barrier and GaN channel layer in high-electron-mobility-transistors (HEMTs)10.1038/s41598-021-01768-4 ↗
34. Trapping effects on AlGaN/GaN HEMT characteristics10.1016/j.sse.2020.107929 ↗
35. Controlling surface/interface states in GaN-based transistors: Surface/interface trap origins and passivation technologies10.1063/5.0039564 ↗
36. Influence of the interface acceptor-like traps on the transient response of AlGaN/GaN HEMTs10.1109/led.2012.2227235 ↗
37. An overview on analyses and suppression methods of trapping effects in AlGaN/GaN HEMTs10.1109/access.2021.3139443 ↗
38. Investigation of trapping effects in Schottky lightly doped P-GaN gate stack under γ-ray irradiation10.1063/5.0094090 ↗
39. Proton-irradiation effects on charge trapping-related instability of normally-off AlGaN/GaN recessed MISHFETs10.5573/JSTS.2019.19.2.214 ↗
40. Shockley-Read-Hall recombination and trap levels in point defects: A first-principles study10.1103/physrevb.108.094113 ↗
41. 1985
42. AlfaMC: A fast alpha particle transport Monte Carlo code10.1016/j.nima.2013.11.026 ↗
43. Ion beam irradiation of nanostructures–A 3D Monte Carlo simulation code10.1016/j.nimb.2011.07.004 ↗
44. IM3D: A parallel Monte Carlo code for efficient simulations of primary radiation displacements and damage in 3D geometry10.1038/srep18130 ↗
45. Radiation-induced soft errors in advanced semiconductor technologies10.1109/TDMR.2005.853449 ↗
46. 10.1142/9789812795755_000310.1142/9789812795755_0003 ↗
47. An approximate analytical solution of the Bethe equation for charged particles in the radiotherapeutic energy range10.1038/s41598-017-10554-0 ↗
48. Particle radiation therapy using proton and heavier ion beams10.1200/jco.2006.09.7816 ↗
49. Swift heavy ion irradiation of InP: Thermal spike modeling of track formation10.1103/physrevb.73.184107 ↗
50. The role of a radial ion-track distribution in semiconductors studied by numerical simulations10.1016/j.radphyschem.2009.06.025 ↗
51. TCAD simulation study of heavy ion radiation effects on hetero-junction tunnel FET with different source materials10.1038/s41598-024-58371-6 ↗
52. A unified model for TCAD simulation of the charge generated in semiconductors by low-energy alpha particles and protons10.1016/j.microrel.2022.114725 ↗
53. Heavy-ion irradiation study in SOI-based and bulk-based junctionless FinFETs using 3D-TCAD simulation10.1016/j.microrel.2015.09.011 ↗
54. TCAD investigation of the transport of carriers deposited by alpha particles in silicon carbide power Schottky devices10.1016/j.microrel.2021.114317 ↗
55. Order enables efficient electron-hole separation at an organic heterojunction with a small energy loss10.1038/s41467-017-02457-5 ↗
56. Single event effects analysis and charge collection mechanisms on AlGaN/GaN HEMTs10.1088/1361-6641/ab058a ↗
57. Drift and diffusion of charge carriers in silicon and their empirical relation to the electric field10.1016/0038-1101(87)90106-7 ↗
58. Evidence of Fowler–Nordheim tunneling in gate leakage current of AlGaN/GaN HEMTs at room temperature10.1109/TED.2014.2361436 ↗
59. Metal induced inhomogeneous Schottky barrier height in AlGaN/GaN Schottky diode10.1063/1.4811756 ↗
60. Schottky barrier height in GaN/AlGaN heterostructures10.1016/j.sse.2006.04.011 ↗
61. Single-event damage-induced gate-leakage mechanisms in AlGaN/GaN high-electron-mobility transistors10.1109/ted.2021.3075667 ↗
62. Trapping effects and microwave power performance in AlGaN/GaN HEMTs10.1109/16.906437 ↗
63. Threshold voltage instability in p-GaN gate AlGaN/GaN HFETs10.1109/ted.2018.2828702 ↗
64. Trapping phenomena and degradation mechanisms in GaN-based power HEMTs10.1016/j.mssp.2017.10.009 ↗
65. Deep trap-induced dynamic on-resistance degradation in GaN-on-Si power MISHEMTs10.1016/j.microrel.2015.10.026 ↗
66. OFF-state trapping phenomena in GaN HEMTs: Interplay between gate trapping, acceptor ionization and positive charge redistribution10.1016/j.microrel.2020.113841 ↗