Impact of the channel length on molybdenum disulfide field effect transistors with hafnia-based high-k dielectric gate

Field effect transistors (FETs) using two-dimensional molybdenum disulfide (MoS2) as the channel material has been considered one of the most potential candidates for future complementary metal-oxide-semiconductor technology with low power consumption. However, the understanding of the correlation between the device performance and material properties, particularly for devices with scaling-down channel lengths, is still insufficient. We report in this paper back-gate FETs with chemical-vapor-deposition grown and transferred MoS2 and Zr doped HfO2 ((Hf,Zr)O2, HZO) high-k dielectric gates with channel lengths ranging from 10 to 30 µm with a step of 5 µm. It has been demonstrated that channels with the length to width ratio of 0.2 lead to the most superior performance of the FETs. The MoS2/HZO hybrid FETs show a stable threshold voltage of ∼1.5 V, current on/off ratio of >104, and field effect mobility in excess of 0.38 cm2 V−1 s−1. The impact of the channel lengths on FET performance is analyzed and discussed in depth. A hysteresis loop has been observed in the Ids − Vgs characteristics of the hybrid FETs, which has been further studied and attributed to the charge effect at the interfaces. The HZO films show a relatively weak ferroelectric orthorhombic phase and thus serve mainly as the high-k dielectric gate. Charge trapping in the HZO layer that might induce hysteresis has been discussed. Our results show that MoS2/HZO hybrid FETs possess great potential in future low power and high-speed integrated circuits, and future work will focus on further improvement of the transistor performances using ferroelectric HZO films and the study of devices with even shorter MoS2 channels.