journal article·2015-05-01Open access

Semiconductor to metallic transition in bulk accumulated amorphous indium-gallium-zinc-oxide dual gate thin-film transistor

Minkyu Chun, Md Delwar Hossain Chowdhury, Jin Jang

AIP Advances· Volume 5· Issue 5

Abstract

We investigated the effects of top gate voltage (VTG) and temperature (in the range of 25 to 70 oC) on dual-gate (DG) back-channel-etched (BCE) amorphous-indium-gallium-zinc-oxide (a-IGZO) thin film transistors (TFTs) characteristics. The increment of VTG from -20V to +20V, decreases the threshold voltage (VTH) from 19.6V to 3.8V and increases the electron density to 8.8 x 1018cm−3. Temperature dependent field-effect mobility in saturation regime, extracted from bottom gate sweep, show a critical dependency on VTG. At VTG of 20V, the mobility decreases from 19.1 to 15.4 cm2/V ⋅ s with increasing temperature, showing a metallic conduction. On the other hand, at VTG of - 20V, the mobility increases from 6.4 to 7.5cm2/V ⋅ s with increasing temperature. Since the top gate bias controls the position of Fermi level, the temperature dependent mobility shows metallic conduction when the Fermi level is above the conduction band edge, by applying high positive bias to the top gate.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Thin-Film Transistor Technologies · Silicon Nanostructures and Photoluminescence

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Kyung Hee University Advanced Display Research Center and Department of Information Display, , Seoul 130-701, Korea

Funding

MOTIE/KEIT, Industrial Strategic Technology Development Program

References (24)

Show source-provided references
1. Nature (London) · 2004 · 432 · 48810.1038/nature03090 ↗
2. IEEE Electron Device Lett. · 2011 · 32 · 17010.1109/LED.2010.2093504 ↗
3. Appl. Phys. Lett. · 2010 · 97 · 17350610.1063/1.3503971 ↗
4. IEEE Electron Device Lett. · 2013 · 34 · 153310.1109/LED.2013.2284599 ↗
5. IEEE Electron Device Lett. · 2014 · 35 · 93010.1109/LED.2014.2333014 ↗
6. IEEE Electron Device Lett. · 2014 · 35 · 9310.1109/LED.2013.2290740 ↗
7. IEEE Electron Device Lett. · 2014 · 35 · 56010.1109/LED.2014.2311172 ↗
8. IEEE Electron Device Lett. · 2011 · 32 · 108910.1109/LED.2011.2157798 ↗
9. IEEE Electron Device Lett. · 2014 · 35 · 46110.1109/LED.2014.2305665 ↗
10. J. J. Appl. Phys. · 2009 · 48 · 01130110.1143/JJAP.48.011301 ↗
11. IEEE Electron Device Lett. · 2009 · 56 · 117710.1109/TED.2009.2019157 ↗
12. Appl. Phys. Lett. · 2013 · 103 · 15210310.1063/1.4824875 ↗
13. Phys. Rev. Lett. · 1970 · 25 · 50910.1103/PhysRevLett.25.509 ↗
14. Appl. Phys. Lett. · 2007 · 90 · 25210810.1063/1.2749836 ↗
15. Appl. Phys. Lett. · 2006 · 88 · 03210610.1063/1.2165281 ↗
16. ECS Solid State Lett. · 2012 · 1 · Q1710.1149/2.004202ssl ↗
17. J. Appl. Phys. · 2011 · 110 · 11450310.1063/1.3662869 ↗
18. J. Display Tech. · 2014 · 10 · 91710.1109/JDT.2013.2292580 ↗
19. Appl. Phys. Lett. · 2011 · 98 · 15351110.1063/1.3580611 ↗
20. Appl. Phys. Lett. · 2013 · 103 · 04350910.1063/1.4816587 ↗
21. J. Display Tech. · 2009 · 5 · 46210.1109/JDT.2009.2022064 ↗
22. Thin Solid Films · 2005 · 486 · 3810.1016/j.tsf.2004.11.223 ↗
23. Appl. Phys. Lett. · 2011 · 98 · 20350810.1063/1.3589371 ↗
24. Appl. Phys. Lett. · 2013 · 102 · 15210410.1063/1.4802093 ↗