journal article·2023-01-01Open access

The influence of temperature on the electrical conductivity of GaN piezoelectric semiconductors

YanPeng Qiao, MingHao Zhao, GuoShuai Qin, Chunsheng Lu, CuiYing Fan

AIP Advances· Volume 13· Issue 1

Abstract

GaN is an excellent material choice for power devices due to its excellent properties such as super wide bandgap width and high electron mobility. However, the problem of temperature affects the thermo reliability and hinders the potential of GaN devices. In this paper, the electrical properties of GaN under temperature have been studied by the combination of numerical simulation and experimental research. The electric current change and electrical resistivity of polarized and depolarized GaN semiconductor samples were tested in an environment-test cabinet. Based on the influence of temperature, the expression of the resistivity curve vs temperature was established for polarized and depolarized GaN samples. It is shown that the resistivity model predictions are consistent with experimental results. The I–V characteristic curves under different temperatures were also measured. Thus, such a model is instructive to the reliable design of GaN high-temperature devices. The findings will be instructive to the optimal design of GaN electronic components.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: GaN-based semiconductor devices and materials · Ga2O3 and related materials · ZnO doping and properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanics and Safety Engineering, Zhengzhou University 1 , No. 100 Science Road, Henan Province, Zhengzhou 450001, China

School of Electromechanical Engineering, Henan University of Technology 2 , Henan, Zhengzhou 450001, China

School of Civil and Mechanical Engineering, Curtin University 3 , Western Australia, Perth 6845, Australia

Funding

National Natural Science Foundation of China

References (32)

Show source-provided references
1. Microsyst. Technol. · 2014 · 20 · 910.1007/s00542-013-2029-z ↗
2. Sensors · 2009 · 9 · 891110.3390/s91108911 ↗
3. J. Micromech. Microeng. · 2011 · 21 · 11501810.1088/0960-1317/21/11/115018 ↗
4. Thin Solid Films · 2011 · 519 · 614410.1016/j.tsf.2011.03.134 ↗
5. Sensors · 2017 · 17 · 101510.3390/s17051015 ↗
6. J. Micromech. Microeng. · 2007 · 17 · S14710.1088/0960-1317/17/7/s12 ↗
7. 2010
8. J. Mater. Sci. · 2018 · 54 · 239210.1007/s10853-018-3014-9 ↗
9. Z. Angew. Math. Mech. · 2020 · 100 · e20190030210.1002/zamm.201900302 ↗
10. Mech. Mater. · 2022 · 164 · 10415310.1016/j.mechmat.2021.104153 ↗
11. J. Electron. Mater. · 2019 · 48 · 493910.1007/s11664-019-07280-w ↗
12. J. Appl. Phys. · 2022 · 131 · 09450210.1063/5.0083759 ↗
13. 2013
14. Microelectron. Eng. · 2019 · 216 · 11105210.1016/j.mee.2019.111052 ↗
15. 2017
16. J. Eur. Ceram. Soc. · 2019 · 39 · 480010.1016/j.jeurceramsoc.2019.07.017 ↗
17. J. Appl. Phys. · 1962 · 33 · 4010.1063/1.1728525 ↗
18. Eng. Fract. Mech. · 2014 · 126 · 2710.1016/j.engfracmech.2014.05.011 ↗
19. Nano Energy · 2018 · 43 · 2210.1016/j.nanoen.2017.11.002 ↗
20. Nano Energy · 2019 · 66 · 10408110.1016/j.nanoen.2019.104081 ↗
21. J. Electron. Mater. · 2021 · 50 · 94710.1007/s11664-020-08634-5 ↗
22. Mater. Sci. Semicond. Process. · 2014 · 28 · 13510.1016/j.mssp.2014.08.013 ↗
23. Appl. Phys. Lett. · 2009 · 94 · 10350810.1063/1.3089871 ↗
24. 2017 · 20946
25. Ceram. Int. · 2022 · 48 · 277110.1016/j.ceramint.2021.10.064 ↗
26. 2016
27. Ceram. Int. · 2020 · 46 · 533110.1016/j.ceramint.2019.10.285 ↗
28. Ceram. Int. · 2018 · 44 · 416910.1016/j.ceramint.2017.11.219 ↗
29. 1996
30. 2012
31. Vacuum · 2015 · 119 · 20010.1016/j.vacuum.2015.05.026 ↗
32. J. Phys. F: Met. Phys. · 1987 · 17 · 13110.1088/0305-4608/17/1/019 ↗