journal article·2016-07-01Open access

Effect of top gate potential on bias-stress for dual gate amorphous indium-gallium-zinc-oxide thin film transistor

Minkyu Chun, Jae Gwang Um, Min Sang Park, Md Delwar Hossain Chowdhury, Jin Jang

AIP Advances· Volume 6· Issue 7

Abstract

We report the abnormal behavior of the threshold voltage (VTH) shift under positive bias Temperature stress (PBTS) and negative bias temperature stress (NBTS) at top/bottom gate in dual gate amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors (TFTs). It is found that the PBTS at top gate shows negative transfer shift and NBTS shows positive transfer shift for both top and bottom gate sweep. The shift of bottom/top gate sweep is dominated by top gate bias (VTG), while bottom gate bias (VBG) is less effect than VTG. The X-ray photoelectron spectroscopy (XPS) depth profile provides the evidence of In metal diffusion to the top SiO2/a-IGZO and also the existence of large amount of In+ under positive top gate bias around top interfaces, thus negative transfer shift is observed. On the other hand, the formation of OH− at top interfaces under the stress of negative top gate bias shows negative transfer shift. The domination of VTG both on bottom/top gate sweep after PBTS/NBTS is obviously occurred due to thin active layer.
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Research context

OpenAlex topics: Thin-Film Transistor Technologies · Silicon Nanostructures and Photoluminescence · Silicon and Solar Cell Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Kyung Hee University Advanced Display Research Center and Department of Information Display, , Seoul 02447, South Korea

Funding

MOTIE/KDRC

References (24)

Show source-provided references
1. Nature · 2004 · 432 · 48810.1038/nature03090 ↗
2. IEEE Electron Device Lett · 2011 · 32 · 17010.1109/LED.2010.2093504 ↗
3. Appl. Phys. Lett. · 2010 · 97 · 17350610.1063/1.3503971 ↗
4. J. Appl. Phys. · 2014 · 115 · 13450210.1063/1.4870458 ↗
5. Appl. Phys. Lett. · 2013 · 102 · 14350610.1063/1.4801762 ↗
6. IEEE Electron Device Lett · 2013 · 34 · 156910.1109/LED.2013.2286824 ↗
7. IEEE Electron Device Lett · 2011 · 32 · 108910.1109/LED.2011.2157798 ↗
8. AIP Advances · 2015 · 5 · 05716510.1063/1.4922005 ↗
9. IEEE Electron Device Lett · 2013 · 34 · 153310.1109/LED.2013.2284599 ↗
10. Electron Device Letters, IEEE · 2014 · 35 · 9310.1109/LED.2013.2290740 ↗
11. IEEE Electron Device Lett · 2014 · 35 · 93010.1109/LED.2014.2333014 ↗
12. Appl. Phys. Lett. · 2011 · 98 · 15351110.1063/1.3580611 ↗
13. NPG Asia Mater. · 2010 · 2 · 1510.1038/asiamat.2010.5 ↗
14. ECS Solid State Letters · 2012 · 1 · Q1710.1149/2.004202ssl ↗
15. J. Appl. Phys. · 2011 · 110 · 11450310.1063/1.3662869 ↗
16. Electron Devices, IEEE Transactions on · 2015 · 62 · 370310.1109/TED.2015.2478839 ↗
17. Electron Devices, IEEE Transactions on · 2012 · 59 · 335710.1109/TED.2012.2220367 ↗
18. J. Appl. Phys. · 1983 · 54 · 254010.1063/1.332323 ↗
19. J. Appl. Phys. · 1990 · 68 · 523410.1063/1.347040 ↗
20. J. Vacuum Science & Technology B · 2015 · 33 · 03060310.1116/1.4919234 ↗
21. Appl. Phys. Lett. · 2015 · 107 · 23350910.1063/1.4937441 ↗
22. Semicond. Sci. Technol. · 1992 · 7 · 110310.1088/0268-1242/7/8/013 ↗
23. J. Vac. Sci. Technol. B · 2013 · 31 · 06120510.1116/1.4827276 ↗
24. Appl. Phys. Lett. · 2014 · 105 · 23350410.1063/1.4903874 ↗