journal article·2026-06-17Open access

Thin‐Film Transistor Based Active Taxel for Multimode Tactile Perception and Fused Processing

Sihao Wu, Zheng Zhou, Aoran Xu, Lutong Wang, Tingchen Yi, Chuanlin Sun, Haotong Zhu, Jiaqi Li, Junchen Dong, Li Zhou, Lifeng Liu, Yimao Cai, Dedong Han, Xing Zhang

Abstract

ABSTRACT Skin is the largest‐area organ for humans and embodied intelligent robots, serving as a critical interface for environmental interaction. Thanks to the well‐organized taxel, dynamic‐taxel‐density and fully body wrapping, human skin works as an efficient tactile system for embodied intelligent robots to emulate. Thin‐film transistor (TFT) technology is a well‐known mature semiconductor process for mass production with the largest‐area substrate, inherently suitable for artificial skin developing. In this work, we propose an active multimode fused (AMF) artificial skin developed from a standard TFT process for intelligent robots. A novel 2T‐1C taxel integrating optical and electrostatic capacitive receptors is developed for cross‐modal feature extraction. A 10×10 AMF artificial skin sample within 1 cm 2 is fabricated and experimentally validated through Braille perception. The AMF skin has high tactile robustness, retaining 81.7% accuracy in complex fingerprint tasks even with 45% information loss. Moreover, a fully skin‐wrapped dexterous hand integrated with a dynamic‐taxel‐density tactile system is presented, enabling accurate texture‐ and shape‐dependent object recognition with 80% less data movement and 76.6% lower computational cost. The TFT‐based artificial skin paves an approach for the development of embodied intelligent robots with full‐body skin wrapping.
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Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Thin-Film Transistor Technologies · Advanced Materials and Mechanics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Integrated Circuits Peking University Beijing China

Beijing Advanced Innovation Center for Integrated Circuits Beijing China

School of Information & Communication Engineering Beijing Information Science and Technology University Beijing China

BOE Technology Group Co., Ltd. Beijing China

Funding

Beijing Nova Program

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