journal article·2024-02Open access

Proposition of Adaptive Read Bias: A Solution to Overcome Power and Scaling Limitations in Ferroelectric‐Based Neuromorphic System

Ryun‐Han Koo, Wonjun Shin, Seungwhan Kim, Jiseong Im, Sung‐Ho Park, Jong Hyun Ko, Dongseok Kwon, Jae‐Joon Kim, Daewoong Kwon, Jong‐Ho Lee

Advanced Science· Volume 11· Issue 5

Abstract

Abstract Hardware neuromorphic systems are crucial for the energy‐efficient processing of massive amounts of data. Among various candidates, hafnium oxide ferroelectric tunnel junctions (FTJs) are highly promising for artificial synaptic devices. However, FTJs exhibit non‐ideal characteristics that introduce variations in synaptic weights, presenting a considerable challenge in achieving high‐performance neuromorphic systems. The primary objective of this study is to analyze the origin and impact of these variations in neuromorphic systems. The analysis reveals that the major bottleneck in achieving a high‐performance neuromorphic system is the dynamic variation, primarily caused by the intrinsic 1/f noise of the device. As the device area is reduced and the read bias (VRead) is lowered, the intrinsic noise of the FTJs increases, presenting an inherent limitation for implementing area‐ and power‐efficient neuromorphic systems. To overcome this limitation, an adaptive read‐biasing (ARB) scheme is proposed that applies a different VRead to each layer of the neuromorphic system. By exploiting the different noise sensitivities of each layer, the ARB method demonstrates significant power savings of 61.3% and a scaling effect of 91.9% compared with conventional biasing methods. These findings contribute significantly to the development of more accurate, efficient, and scalable neuromorphic systems.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Semiconductor materials and devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Inter‐University Semiconductor Research Center Department of Electrical and Computer Engineering Seoul National University Seoul 08826 South Korea

Department of Electrical Engineering Hanyang University Seoul 04763 South Korea

Ministry of Science and ICT Sejong 30109 South Korea

References (78)

Show source-provided references
1. 10.1038/s41928-017-0006-810.1038/s41928-017-0006-8 ↗
2. 10.1038/s41467-017-00803-110.1038/s41467-017-00803-1 ↗
3. 10.1038/nnano.2012.24010.1038/nnano.2012.240 ↗
4. 10.1038/s41928-019-0331-110.1038/s41928-019-0331-1 ↗
5. Han J. K. · Adv. Sci. · 2022 · 9 · 18
6. 10.1039/C9NH00341J10.1039/C9NH00341J ↗
7. Jang J. · Adv. Sci. · 2022 · 9 · 22
8. 10.1038/s41586-022-04992-810.1038/s41586-022-04992-8 ↗
9. J. F.Kang B.Gao P.Huang H. T.Li Y. D.Zhao Z.Chen C.Liu L. F.Liu X. Y.Liu in2015 IEEE Int. Electron Devices Meeting (IEDM) IEEE Washington DC2015.
10. S.Yu in2014 IEEE Int. Symp. on Circuits and Systems (ISCAS) IEEE Melbourne VIC2014.
11. S.Kim M.Ishii S.Lewis T.Perri M.BrightSky W.Kim R.Jordan G. W.Burr N.Sosa A.Ray J.‐P.Han C.Miller K.Hosokawa C.Lam in2015 IEEE Int. Electron Devices Meeting (IEDM) IEEE Washington DC2015.
12. M.Suri O.Bichler D.Querlioz O.Cueto L.Perniola V.Sousa D.Vuillaume C.Gamrat B.DeSalvo in2011 IEEE Int. Electron Devices Meeting (IEDM) IEEE Washington DC2011.
13. Xu M. · Adv Funct Mater · 2020 · 30 · 50
14. 10.1002/adfm.20221461510.1002/adfm.202214615 ↗
15. 10.1109/TED.2019.295973210.1109/TED.2019.2959732 ↗
16. 10.1109/TBCAS.2015.241442310.1109/TBCAS.2015.2414423 ↗
17. D.Zhang L.Zeng Y.Qu Y.Zhang M.Wang W.Zhao Y.Wang in2015 IEEE Int. Symp. on Circuits and Systems (ISCAS) IEEE Lisbon Portugal2015.
18. 10.1109/TED.2021.306871610.1109/TED.2021.3068716 ↗
19. 10.1002/adma.20220604210.1002/adma.202206042 ↗
20. 10.1002/aelm.20220095110.1002/aelm.202200951 ↗
21. Shin W. · IEEE Electron Device Lett. · 2022 · 44 · 2
22. 10.1021/acsaelm.0c0083210.1021/acsaelm.0c00832 ↗
23. 10.1038/nmat341510.1038/nmat3415 ↗
24. 10.1109/LED.2022.322334010.1109/LED.2022.3223340 ↗
25. Shin W. · IEEE Electron Device Lett. · 2022 · 43 · 6
26. 10.1039/C8FD00114F10.1039/C8FD00114F ↗
27. 10.1080/23746149.2016.125958510.1080/23746149.2016.1259585 ↗
28. 10.1109/TED.2019.290161310.1109/TED.2019.2901613 ↗
29. 10.1063/1.512491510.1063/1.5124915 ↗
30. 10.1038/s41586-023-05759-510.1038/s41586-023-05759-5 ↗
31. 10.1021/acsaelm.2c0002310.1021/acsaelm.2c00023 ↗
32. 10.1109/LED.2015.250184110.1109/LED.2015.2501841 ↗
33. Yu S. · Adv. Mater. · 2013 · 25 · 12
34. 10.1002/admt.20180058910.1002/admt.201800589 ↗
35. 10.1016/j.chaos.2022.11199910.1016/j.chaos.2022.111999 ↗
36. 10.1002/aelm.20180079510.1002/aelm.201800795 ↗
37. Chen P. Y. · IEEE Trans. Electron Devices · 2015 · 62 · 12
38. Shin W. · IEEE Electron Device Lett. · 2022 · 43 · 6
39. 10.1109/LED.2020.303790610.1109/LED.2020.3037906 ↗
40. 10.1103/RevModPhys.53.49710.1103/RevModPhys.53.497 ↗
41. 10.1038/nnano.2013.14410.1038/nnano.2013.144 ↗
42. 10.1103/PhysRevLett.110.14060310.1103/PhysRevLett.110.140603 ↗
43. 10.1038/251599a010.1038/251599a0 ↗
44. Koo R. H. · IEEE Electron Device Lett. · 2023 · 44 · 6
45. 10.1002/aisy.20220035810.1002/aisy.202200358 ↗
46. 10.1002/adfm.20221381610.1002/adfm.202213816 ↗
47. 10.3390/mi1311187010.3390/mi13111870 ↗
48. 10.1039/C3NR05016E10.1039/C3NR05016E ↗
49. 10.1063/1.329113210.1063/1.3291132 ↗
50. 10.1038/s41467-018-04484-210.1038/s41467-018-04484-2 ↗
51. Wu X. · IEEE Trans Circuits Syst II Express Briefs · 2015 · 62 · 11
52. 10.1038/ncomms307210.1038/ncomms3072 ↗
53. 10.1002/admt.20180058910.1002/admt.201800589 ↗
54. Kim D. · ACS Appl Mater Interfaces · 2021 · 13 · 44
55. 10.1109/LED.2017.269808310.1109/LED.2017.2698083 ↗
56. Wang L. · Adv Funct Mater · 2020 · 30 · 45
57. Lu T. · IEEE Trans. Electron Devices · 2023 · 70 · 5
58. Howard A. G. · ArXiv · 2017
59. Wang W. · Inf Syst · 2020 · 2020
60. Li Y. · Adv Neural Inf Process Syst · 2022 · 35
61. 10.1038/ncomms307210.1038/ncomms3072 ↗
62. R.Müller Generation‐recombination noise. ′In Noise in Physical Systems: Proceedings of the Fifth International Conference on Noise Bad Nauheim Fed. Rep. of Germany March 13–16 1978Springer Berlin Heidelberg 1978.10.1007/978-3-642-87640-0_2 ↗
63. 10.1007/978-1-4020-5910-010.1007/978-1-4020-5910-0 ↗
64. 10.1063/1.355750510.1063/1.3557505 ↗
65. 10.1063/1.115051910.1063/1.1150519 ↗
66. 10.1016/S0921-4526(99)00286-010.1016/S0921-4526(99)00286-0 ↗
67. 10.1109/TED.2002.80696610.1109/TED.2002.806966 ↗
68. 10.1109/LED.2021.305119710.1109/LED.2021.3051197 ↗
69. 10.1063/1.36572010.1063/1.365720 ↗
70. Kang D. · Semicond. Sci. Technol. · 2021 · 36 · 12
71. 10.1109/LED.2020.304232510.1109/LED.2020.3042325 ↗
72. 10.1016/j.neucom.2019.09.09910.1016/j.neucom.2019.09.099 ↗
73. Koo R.‐H. · IEEE Electron Device Lett. · 2023 · 44 · 1623
74. R.Chauhan K. K.Ghanshala R. C.Joshi 2018 First Int. Conf. on Secure Cyber Computing and Communication (ICSCCC) IEEE Jalandhar India2018.
75. S.Albawi T. A.Mohammed S.Al‐Zawi in2017 Int. Conf. on Engineering and Technology (ICET) IEEE Antalya Turkey2017.
76. 10.1109/16.5991610.1109/16.59916 ↗
77. 10.1109/TED.2017.273091910.1109/TED.2017.2730919 ↗
78. 10.1109/MCAS.2021.309253310.1109/MCAS.2021.3092533 ↗