Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics (Adv. Electron. Mater. 9/2023)

Transfer Techniques In article number 2201281 Niko Münzenrieder and co-workers report a substrate-free transfer process for ultra-thin electronic devices exhibiting extremely high conformability and flexibility. Metallic temperature sensors and semiconductor thermistors are fabricated using two sacrificial layers that, upon their individual dissolution, enable the transfer of the devices onto various unconventional surfaces while preserving their functionality. Additionally, the possibility of building multilayered electronic structures through sequential transfer processes is demonstrated.