Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends
Source abstract
Abstract
In the semiconductor chemical mechanical polishing (CMP) manufacturing process, the selection of abrasive materials is crucial to the precision, efficiency, and surface quality of devices. This review summarizes the abrasive materials used in semiconductor processing, focusing on their selection principles, material removal mechanisms, and performance optimization strategies. Based on physicochemical properties and polishing behaviors, typical abrasives (SiO2, Al2O3, CeO2, and composite particles) are compared: SiO2 has moderate removal efficiency and good dispersion stability, making it suitable for the polishing of silica-based and low-dielectric-constant insulating layers; Al2O3 is widely used in metal CMP (such as copper and tungsten) due to its high hardness; CeO2 has unique chemical activity and high selectivity, which is advantageous in the shallow trench isolation (STI) process. This review analyzes the current challenges (defect control, slurry stability, environmental constraints) and emerging trends (composite abrasive design, sustainable manufacturing). It provides technical insights for the development of high-precision and high-efficiency CMP processes in semiconductor manufacturing.
Source: europepmc · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced Surface Polishing Techniques · Nanofabrication and Lithography Techniques · Diamond and Carbon-based Materials Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Key Laboratory of Flexible Electronics of Zhejiang Province, Ningbo Institute of Northwestern Polytechnical University, 218 Qingyi Road, Ningbo 315103, China
School of Flexible Electronics (SoFE) and Henan Institute of Flexible Electronics (HIFE), Henan University, 379 Mingli Road, Zhengzhou 450046, China
Luoyang Ship Material Research Institute (LSMRI), 169 Binhai South Road, Luoyang 471023, China
Funding
Major Scientific and Technological Project of Zhejiang Province · Ministry of Industry and Information Technology High Quality Development Special Project · Key Technology Development of Silicone Developing Roller and Its Key Coating Materials · Research and Development of Novel Gridless Crystalline Silicon Solar Cell Fabrication and Module Encapsulation Technology
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