Source abstract
Abstract
Effectively restraining random fluctuation of layer thickness (RFT) during the thin-film epitaxy plays an essential part in improving the quality of low-dimensional materials for device application. While it is already challenging to obtain an ideal growth condition for thickness control, the tangle of RFT with interfacial problems makes it even more difficult to guarantee the properties of heterostructures and the performance of devices. In our research, the RFT of potential barriers and wells within a semiconductor multilayer is demonstrated to correlate with the interfacial grading effect (IFG) and to affect the band offset strongly. Then, the synergetic effect of RFT and IFG that serves as the first domino is shown to impact the subband structure and the electron transport successively. On the basis of an investigation of a quantum cascade structure, statistical results indicate a normal distribution of RFT with a standard deviation of about 1 Å and an extreme value of 3 Å (about one monolayer) for all the layers within 38 cascade periods. The "seemingly negligible" RFT could actually reduce the conduction band offset for tens to hundreds of meV and alter the subband gaps at a rate of 40 meV/monolayer at most. Furthermore, the dependence of different subband gaps on the barrier/well thickness differs from one another. In addition, the distribution of wave function could also be regulated dramatically by RFT to change the type of electron transition and thus the carrier lifetime. Further impacts of RFT and the RFT-modulated subband alignment on electron transport result in two different mechanisms (injection-dominant and extraction-dominant) of electron population inversion (PI), which is manifested by comparatively discussing the results of in situ electron holography and macro performances.
Source: openalex_inverted_index · Quality: baseline
Affiliations
Laboratory of Advanced Materials, Department of Materials Science and Collaborative Innovation Center of Chemistry for Energy Materials, Fudan University, Shanghai 200438, P. R. China
Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Beijing 100083, P. R. China
Department of Chemistry, Fudan University, Shanghai 200433, P. R. China
National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, P. R. China
Key Laboratory of Materials Processing and Mold (Zhengzhou University), Ministry of Education, Zhengzhou 450002, P. R. China
Funding
Ministry of Science and Technology of the People's Republic of China · National Natural Science Foundation of China