journal article·2022-09-21

Bi2Se3 Growth on (001) GaAs Substrates for Terahertz Integrated Systems

Yongchen Liu, Wilder Acuna, Huairuo Zhang, Dai Q. Ho, Ruiqi Hu, Zhengtianye Wang, Anderson Janotti, Garnett Bryant, Albert V. Davydov, Joshua M. O. Zide, Stephanie Law

ACS Applied Materials & Interfaces· Volume 14· Issue 37
Publisher page

Abstract

Terahertz (THz) technologies have been of interest for many years due to the variety of applications including gas sensing, nonionizing imaging of biological systems, security and defense, and so forth. To date, scientists have used different classes of materials to perform different THz functions. However, to assemble an on-chip THz integrated system, we must understand how to integrate these different materials. Here, we explore the growth of Bi2Se3, a topological insulator material that could serve as a plasmonic waveguide in THz integrated devices, on technologically important GaAs(001) substrates. We explore surface treatments and find that an atomically smooth GaAs surface is critical to achieving high-quality Bi2Se3 films despite the relatively weak film/substrate interaction. Calculations indicate that the Bi2Se3/GaAs interface is likely selenium-terminated and shows no evidence of chemical bonding between the Bi2Se3 and the substrate. These results are a guide for integrating van der Waals materials with conventional semiconductor substrates and serve as the first steps toward achieving an on-chip THz integrated system.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Topological Materials and Phenomena · 2D Materials and Applications · Terahertz technology and applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering, University of Delaware, Newark, Delaware 19716, United States

Materials Science and Engineering Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States

Theiss Research, Inc., La Jolla, California 92037, United States

Nanoscale Device Characterization Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, United States

Funding

National Institute of Standards and Technology · Division of Materials Research · Material Genome Initiative

References (53)

Show source-provided references
1. 10.1088/0031-9155/47/7/20110.1088/0031-9155/47/7/201 ↗
2. 10.1109/jproc.2007.89890310.1109/jproc.2007.898903 ↗
3. 10.3390/condmat502002510.3390/condmat5020025 ↗
4. 10.1109/ojsscs.2021.311074810.1109/ojsscs.2021.3110748 ↗
5. 10.1111/1541-4337.1249010.1111/1541-4337.12490 ↗
6. 10.3390/app1101007110.3390/app11010071 ↗
7. 10.1016/j.pquantelec.2010.06.00210.1016/j.pquantelec.2010.06.002 ↗
8. 10.34133/2019/648297510.34133/2019/6482975 ↗
9. Singh, K.; Kumar, S.; Bandyopadhyay, A.; Sengupta, A. Characterization of Hollow-Core-Metal Waveguide Using Broadband THz Time Domain Spectroscopy for High-Pressure and Temperature Sensor. Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XIV, 2021.10.1117/12.2582451 ↗
10. 10.1063/5.007189510.1063/5.0071895 ↗
11. 10.1103/physrevmaterials.4.11520210.1103/physrevmaterials.4.115202 ↗
12. 10.1103/physrevlett.124.22640310.1103/physrevlett.124.226403 ↗
13. 10.1002/adom.20140051310.1002/adom.201400513 ↗
14. 10.1116/1.513990510.1116/1.5139905 ↗
15. 10.1021/acs.cgd.1c0066310.1021/acs.cgd.1c00663 ↗
16. 10.1116/1.494113410.1116/1.4941134 ↗
17. 10.1116/1.501797710.1116/1.5017977 ↗
18. 10.3952/lithjphys.4540410.3952/lithjphys.45404 ↗
19. 10.1063/1.221602610.1063/1.2216026 ↗
20. 10.1007/s11664-013-2890-710.1007/s11664-013-2890-7 ↗
21. 10.1063/1.353284510.1063/1.3532845 ↗
22. 10.1088/1367-2630/aa759c10.1088/1367-2630/aa759c ↗
23. 10.1088/0957-4484/25/24/24570110.1088/0957-4484/25/24/245701 ↗
24. 10.1116/1.366808210.1116/1.3668082 ↗
25. 10.1063/1.365599510.1063/1.3655995 ↗
26. 10.1016/j.apsusc.2016.11.18910.1016/j.apsusc.2016.11.189 ↗
27. 10.1063/1.9471510.1063/1.94715 ↗
28. 10.1063/1.9402110.1063/1.94021 ↗
29. 10.1016/0022-0248(78)90321-410.1016/0022-0248(78)90321-4 ↗
30. 10.1063/1.9221210.1063/1.92212 ↗
31. 10.1002/admi.20140013410.1002/admi.201400134 ↗
32. 10.1002/adma.20120293610.1002/adma.201202936 ↗
33. 10.1063/1.478977510.1063/1.4789775 ↗
34. 10.1021/cg201636g10.1021/cg201636g ↗
35. van der PAUW L. J. · 1991 · 17410.1142/9789814503464_0017 ↗
36. 10.1038/ncomms113110.1038/ncomms1131 ↗
37. 10.1021/acs.nanolett.5b0377010.1021/acs.nanolett.5b03770 ↗
38. 10.1007/s12274-020-2894-610.1007/s12274-020-2894-6 ↗
39. 10.1116/1.501596810.1116/1.5015968 ↗
40. 10.1103/physrevb.87.24530210.1103/physrevb.87.245302 ↗
41. 10.1038/ncomms863010.1038/ncomms8630 ↗
42. 10.1063/1.34764110.1063/1.347641 ↗
43. 10.1063/1.45851710.1063/1.458517 ↗
44. 10.1002/anie.19920187110.1002/anie.199201871 ↗
45. 10.1038/371683a010.1038/371683a0 ↗
46. 10.1088/1361-648x/ab7fd810.1088/1361-648x/ab7fd8 ↗
47. 10.1103/physrev.136.b86410.1103/physrev.136.b864 ↗
48. 10.1103/physrev.140.a113310.1103/physrev.140.a1133 ↗
49. 10.1103/PhysRevLett.100.13640610.1103/PhysRevLett.100.136406 ↗
50. 10.1103/physrevb.50.1795310.1103/physrevb.50.17953 ↗
51. 10.1103/physrevb.54.1116910.1103/physrevb.54.11169 ↗
52. 10.1103/physrevb.59.175810.1103/physrevb.59.1758 ↗
53. 10.1063/1.338234410.1063/1.3382344 ↗