Impact of Heterointerfaces in Solar Cells Using ZnSnP2 Bulk Crystals
Source abstract
Abstract
We report on the optimization of interface structure in ZnSnP 2 solar cells. The effects of back electrode materials and related interface on photovoltaic performance were investigated. It was clarified that a conventional structure Mo/ZnSnP 2 showed a Schottky-behavior, while an ohmic-behavior was observed in the Cu/ZnSnP 2 structure annealed at 300 °C. STEM-EDX analysis suggested that Cu–Sn–P ternary compound was formed at the interface. This compound is considered to play an important role to obtain the ohmic contact between ZnSnP 2 and Cu. In addition, it was clarified that the aqua regia etching of ZnSnP 2 bulk crystals before chemical bath deposition process for the preparation of buffer layer was effective to remove the layer including lattice defects introduced by mechanical-polishing, which was supported by TEM observations and photoluminescence measurements. This means that the carrier transport across the interface was improved because of the reduced defect at the interface. Consequently, the conversion efficiency of approximately 2% was achieved with the structure of Al/ZnO;Al/ZnO/CdS/ZnSnP 2 /Cu, where the values of short circuit current density, J SC, open circuit voltage, V OC, and fill factor, FF, were 8.2 mA cm –2, 0.452 V, and 0.533, respectively. However, the value of V OC was largely low considering the bandgap value of ZnSnP 2 . To improve the conversion efficiency, the optimization of buffer layer material is considered to be essential in the viewpoint of band alignment.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Chalcogenide Semiconductor Thin Films · Quantum Dots Synthesis And Properties · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Science and Engineering, Kyoto University, Kyoto 606-8501, Japan
Department of Electrical and Electronic Engineering, Ritsumeikan University, Kusatsu, Shiga 527-8577, Japan
Funding
Japan Society for the Promotion of Science
References (23)
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