journal article·2025-06-18

Doping-Free Carbon-Nanotube Transistors as Wide-Temperature-Range Devices

Meng Deng, Fan Lu, Ningfei Gao, Tian Pei, Haojin Xiu, Hairan Shi, Zhanchun Fan, Qi Zhang, Xiangjun Xin, Leijing Yang, Nan Wei, Haitao Xu

ACS Applied Materials & Interfaces· Volume 17· Issue 24
Publisher page

Abstract

With the development of fields such as lunar exploration and automotive technology, the importance of devices suitable for wide-temperature range is increasingly highlighted. Chemically doped devices, represented by silicon, hardly meet wide-temperature-range requirements, as impurities affect transistor operation at both low and high temperatures. Carbon nanotube (CNT) transistors have high- and low-temperature advantages due to their doping-free structure. In this study, we investigated operation in the temperature range of 10 to 473 K of both n- and p-type field-effect transistors based on network carbon nanotube thin film, complementing the research in wide-temperature-range transport characteristics of CNT transistors, and explored the mechanism of the devices. Experimental results demonstrate that compared to other structures, at high temperature, doping-free carbon nanotube field-effect transistors exhibit no intrinsic excitation induced device leakage, maintaining an on–off ratio of over 10 3 even at 473 K. At low temperature, no carrier freeze-out issues are observed, resulting in a more stable threshold voltage. Those results explore the advantage of the doping-free device in the wide-temperature range scenario, being free from dopant that can affect performance at extreme temperatures, revealing the great potential of carbon-based devices for wide-temperature-range applications.
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Research context

OpenAlex topics: Carbon Nanotubes in Composites · Graphene research and applications · Nanowire Synthesis and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Beijing Key Laboratory of Space-Ground Interconnection and Convergence, School of Electronic Engineering, State Key Laboratory of Information Photonics and Optical Communications

Beijing University of Posts and Telecommunications (BUPT)

Key Laboratory for the Physics and Chemistry of Nanodevices and Center for Carbon-Based Electronics, School of Electronics

Peking University

Beijing Institute of Spacecraft System Engineering

Beijing Institute of Carbon-Based Integrated Circuits

Beijing Academy of Quantum Information Sciences

Chongqing Institute of Carbon-Based Integrated Circuits

Institute of Carbon-based Thin Film Electronics

Funding

National Natural Science Foundation of China · Beijing Nova Program · China Academy of Space Technology

References (43)

Show source-provided references
1. 10.1038/s41578-024-00731-910.1038/s41578-024-00731-9 ↗
2. 10.1038/s41467-023-43228-910.1038/s41467-023-43228-9 ↗
3. 10.1002/adfm.20100256310.1002/adfm.201002563 ↗
4. 10.1038/s41928-020-00531-310.1038/s41928-020-00531-3 ↗
5. Sze, S. M.; Li, Y.; Ng, K. K. Physics of semiconductor devices; John Wiley & Sons: 2021.
6. Liu Y. S. · China Academic Journal · 1998 · 28 · 412
7. MIL-M-38510, U.S. Department of Defense, 2005.
8. MIL-PRF-38535, U.S. Department of Defense, 2018.
9. 10.1109/JSTARS.2023.334085310.1109/JSTARS.2023.3340853 ↗
10. 10.1016/0038-1101(87)90190-010.1016/0038-1101(87)90190-0 ↗
11. 10.1109/55.4695310.1109/55.46953 ↗
12. 10.1109/JSSC.1986.105255510.1109/JSSC.1986.1052555 ↗
13. 10.1109/JDT.2013.225091210.1109/JDT.2013.2250912 ↗
14. 10.1109/16.4779610.1109/16.47796 ↗
15. 10.1142/S179329201550093910.1142/S1793292015500939 ↗
16. 10.1109/101.4605410.1109/101.46054 ↗
17. 10.1088/1674-1056/25/7/07850110.1088/1674-1056/25/7/078501 ↗
18. 10.1109/33.14850910.1109/33.148509 ↗
19. Ke D. M. · Microelectronics · 1990 · 20 · 83
20. 10.1016/0026-2714(84)90476-110.1016/0026-2714(84)90476-1 ↗
21. 10.1063/1.173632710.1063/1.1736327 ↗
22. Tzou, A. J.; Lee, C. H.; Ho, S. Y.; Kuo, H. C.; Huang, J. J. Handbook of GaN Semiconductor Materials and Devices, 1st ed. 2017.
23. 10.1016/j.microrel.2004.03.00810.1016/j.microrel.2004.03.008 ↗
24. 10.1109/TED.2009.203909310.1109/TED.2009.2039093 ↗
25. 10.1016/j.sse.2012.10.01810.1016/j.sse.2012.10.018 ↗
26. 10.1016/j.chip.2023.10006410.1016/j.chip.2023.100064 ↗
27. 10.3390/nano1316233310.3390/nano13162333 ↗
28. 10.1016/j.carbon.2014.07.00110.1016/j.carbon.2014.07.001 ↗
29. 10.1016/j.sse.2013.10.01010.1016/j.sse.2013.10.010 ↗
30. 10.1021/acsnano.6b0239510.1021/acsnano.6b02395 ↗
31. 10.1021/nn503627h10.1021/nn503627h ↗
32. 10.1038/354056a010.1038/354056a0 ↗
33. 10.1126/science.aaj162810.1126/science.aaj1628 ↗
34. 10.1007/s12274-022-4259-910.1007/s12274-022-4259-9 ↗
35. 10.1002/aelm.20210020210.1002/aelm.202100202 ↗
36. 10.1103/PhysRevB.63.24541610.1103/PhysRevB.63.245416 ↗
37. Razavi, B. Design of analog CMOS integrated circuits; Tsinghua University Press: 2001.
38. 10.1021/acsnano.3c1322010.1021/acsnano.3c13220 ↗
39. 10.1021/nl071710710.1021/nl0717107 ↗
40. 10.1021/nn901079p10.1021/nn901079p ↗
41. Neudeck G. W. · Proceedings of the 15th Biennial University/Government/Industry Microelectronics Symposium · 2003 · 21410.1109/UGIM.2003.1225728 ↗
42. 10.1021/acsami.4c1245310.1021/acsami.4c12453 ↗
43. 10.1109/TIE.1982.35664510.1109/TIE.1982.356645 ↗