journal article·2024-06-19

High χ P2PFBEMA-b-P2VP Block Copolymers Forming 6–8 nm Domains for Semiconductor Lithography

Mengge Wang, Tao Xue, Han Miao, Wanqing Wu, Zhipeng Zhang, Muzi Han, Xianhe Liu, Xinxin Li

ACS Applied Materials & Interfaces· Volume 16· Issue 24
Publisher page

Abstract

We leveraged the potential of high χ-low N block copolymer (BCP), namely, poly[2-(perfluorobutyl) ethyl methacrylate]-block-poly(2-vinylpyridine) (P2PFBEMA-b-P2VP), and demonstrated its utility in next-generation nanomanufacturing. By combining molecular dynamics simulations with experiments, the χ value was calculated to be as high as 0.4 (at 150 °C), surpassing similar structures. Highly ordered features suitable for application were observed, ranging in periods from 19.0 nm down to 12.1 nm, with feature sizes as small as 6 nm. Transmission electron microscopy images of the BCP solutions indicated that preformed micelles in the solution facilitated the self-assembly process of the thin film. In addition, the vertical or parallel orientation of the cylindrical structure was determined by manipulating the solvent, substrate, and annealing conditions. Finally, guided by a wide topographical template, nearly defect-free directed self-assembly (DSA) lines with a resolution of 8 nm were achieved, highlighting its potential practical application in DSA lithography technology.
Source: europepmc · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Block Copolymer Self-Assembly · Advanced Polymer Synthesis and Characterization · Organic Electronics and Photovoltaics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Key Laboratory of Specially Functional Polymeric Materials and Related Technology (Ministry of Education), School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China

School of Microelectronics, Fudan University, Shanghai 200433, China

Funding

Fundamental Research Funds for the Central Universities · National Integrated Circuit Innovation Center, Fudan University

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