journal article·2022-12-28

Control of Charge Carrier Relaxation at the Au/WSe2 Interface by Ti and TiO2 Adhesion Layers: Ab Initio Quantum Dynamics

Teng-Fei Lu, Sraddha Agrawal, Marina Tokina, Weibin Chu, Daniel Hirt, Patrick E. Hopkins, Oleg V. Prezhdo

ACS Applied Materials & Interfaces· Volume 14· Issue 51
Publisher page

Abstract

Phonon-mediated charge relaxation plays a vital role in controlling thermal transport across an interface for efficient functioning of two-dimensional (2D) nanostructured devices. Using a combination of nonadiabatic molecular dynamics with real-time time-dependent density functional theory, we demonstrate a strong influence of adhesion layers at the Au/WSe2 interface on nonequilibrium charge relaxation, rationalizing recent ultrafast time-resolved experiments. Ti oxide layers (TiOx) create a barrier to the interaction between Au and WSe2 and extend hot carrier lifetimes, creating benefits for photovoltaic and photocatalytic applications. In contrast, a metallic Ti layer accelerates the energy flow, as needed for efficient heat dissipation in electronic devices. The interaction of metallic Ti with WSe2 causes W–Se bond scissoring and pins the Fermi level. The Ti adhesion layer enhances the electron–phonon coupling due to an increased density of states and the light mass of the Ti atom. The conclusions are robust to presence of typical point defects. The atomic-scale ab initio analysis of carrier relaxation at the interfaces advances our knowledge in fabricating nanodevices with optimized electronic and thermal properties.
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Research context

OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal properties of materials · Graphene research and applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials Science and Engineering, Dalian Jiaotong University, Dalian 116028, Liaoning Province, China

Department of Chemistry, University of Southern California, Los Angeles, California 90089, United States

Key Laboratory of Computational Physical Sciences (Ministry of Education), Institute of Computational Physical Sciences, Fudan University, Shanghai 200433, People’s Republic of China

Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States

Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States

Department of Physics, University of Virginia, Charlottesville, Virginia 22904, United States

Department of Physics and Astronomy, University of Southern California, Los Angeles, California 90089, United States

Funding

Semiconductor Research Corporation · U.S. Department of Defense

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