Printed n- and p-Channel Transistors using Silicon Nanoribbons Enduring Electrical, Thermal, and Mechanical Stress

High Resolution Image Download MS PowerPoint Slide Printing technologies are changing the face of electronics with features such as resource-efficiency, low-cost, and novel form factors. While significant advances have been made in terms of organic electronics, the high-performance and stable transistors by printing, and their large-scale integration leading to fast integrated circuits remains a major challenge. This is because of the difficulties to print high-mobility semiconducting materials and the lack of high-resolution printing techniques. Herein, we present silicon based printed n- and p-channel transistors to demonstrate the possibility of developing high-performance complementary metal–oxide–semiconductor (CMOS) computing architecture. The direct roll transfer printing is used here for deterministic assembly of high-mobility single crystal silicon nanoribbons arrays on a flexible polyimide substrate. This is followed by high-resolution electrohydrodynamic printing to define source/drain/gate electrodes and to encapsulate, thus leading to printed devices. The printed transistors show effective peak mobilities of 15 cm 2 /(V s) (n-channel) and 5 cm 2 /(V s) (p-channel) at low 1 V drain bias. Furthermore, the effect of electrical, mechanical, and thermal stress on the performance and stability of the encapsulated transistors is investigated. The transistors showed stable transfer characteristics even after: (i) continuous 4000 transfer cycles, (ii) excruciating 10000 bending cycles at different bending radii (40, 25, and 15 mm), and (iii) between 15 and 60 °C temperatures.