Locally Reinforced Polymer-Based Composites for Elastic Electronics
Source abstract
Abstract
A promising approach to fabricating elastic electronic systems involves processing thin film circuits directly on the elastic substrate by standard photolithography. Thin film devices are generally placed onto stiffer islands on the substrate surface to protect devices from excessive strain while still achieving a globally highly deformable system. Here we report a new method to achieve island architectures by locally reinforcing polymeric substrates at the macro- and microscale using magnetically responsive anisotropic microparticles. We demonstrate that the resulting particle-reinforced elastic substrates can be made smooth enough for the patterning and successful operation of thin film transistors with transfer characteristics comparable to state-of-the-art devices.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Advanced Materials and Mechanics · Conducting polymers and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Philips Corporate Technologies, 5.006 High Tech Campus 34, Eindhoven, 5656AE, The Netherlands
References (14)
Show source-provided references
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