journal article·2024-05-01

Pure ZrO2 Ferroelectric Thin Film for Nonvolatile Memory and Neural Network Computing

Zijian Wang, Zeyu Guan, He Wang, Xiang Zhou, Jiachen Li, Shengchun Shen, Yuewei Yin, Xiaoguang Li

ACS Applied Materials & Interfaces· Volume 16· Issue 17
Publisher page

Abstract

The recent discovery of ferroelectricity in pure ZrO 2 has drawn much attention, but the information storage and processing performances of ferroelectric ZrO 2 -based nonvolatile devices remain open for further exploration. Here, a ZrO 2 (∼8 nm)-based ferroelectric capacitor using RuO 2 oxide electrodes is fabricated, and the ferroelectric orthorhombic phase evolution under electric field cycling is studied. A ferroelectric remnant polarization (2 P r ) of >30 μC/cm 2, leakage current density of ∼2.79 × 10 –8 A/cm 2 at 1 MV/cm, and estimated polarization retention of >10 years are achieved. When the ferroelectric capacitor is connected with a transistor, a memory window of ∼0.8 V and eight distinct states can be obtained in such a ferroelectric field-effect transistor (FeFET). Through the conductance manipulation of the FeFET, a high object image recognition accuracy of ∼93.32% is achieved on the basis of the CIFAR-10 dataset in the convolutional neural network (CNN) simulation, which is close to the result of ∼94.20% obtained by floating-point-based CNN software. These results demonstrate the potential of ferroelectric ZrO 2 devices for nonvolatile memory and artificial neural network computing.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Ferroelectric and Negative Capacitance Devices · Advanced Memory and Neural Computing · Ferroelectric and Piezoelectric Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Hefei National Research Center for Physical Sciences at the Microscale, Department of Physics and CAS Key Laboratory of Strongly-Coupled Quantum Matter Physics, University of Science and Technology of China, Hefei, Anhui 230026, People’s Republic of China

Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, Jiangsu 210093, People’s Republic of China

Funding

National Key Research and Development Program of China · Fundamental Research Funds for the Central Universities · National Natural Science Foundation of China

References (69)

Show source-provided references
1. 10.1038/nature1453910.1038/nature14539 ↗
2. 10.1016/0160-791X(90)90029-C10.1016/0160-791X(90)90029-C ↗
3. 10.1038/s41578-019-0159-310.1038/s41578-019-0159-3 ↗
4. 10.1021/acsami.0c1018410.1021/acsami.0c10184 ↗
5. 10.1002/adma.20220604210.1002/adma.202206042 ↗
6. 10.1038/s41467-022-28303-x10.1038/s41467-022-28303-x ↗
7. 10.1021/acsami.2c0444110.1021/acsami.2c04441 ↗
8. 10.1002/adma.20220490410.1002/adma.202204904 ↗
9. 10.1109/JEDS.2022.319511910.1109/JEDS.2022.3195119 ↗
10. Kil, D. S.; Song, H. S.; Lee, K. J.; Hong, K.; Kim, J. H.; Park, K. S.; Yeom, S. J.; Roh, J. S.; Kwak, N. J.; Sohn, H. C.; Kim, J. W.; Park, S. W. Development of New TiN/ZrO2/Al2O3/ZrO2/TiN Capacitors Extendable to 45nm Generation DRAMs Replacing HfO2 Based Dielectrics. Proceedings of the 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers; Honolulu, HI, June 13–15, 2006; pp 38–39,10.1109/VLSIT.2006.1705205.10.1109/VLSIT.2006.1705205 ↗
11. 10.1016/j.jeurceramsoc.2016.10.02810.1016/j.jeurceramsoc.2016.10.028 ↗
12. 10.1063/5.000283510.1063/5.0002835 ↗
13. Boscke T. S. · 2010
14. 10.1063/5.007546610.1063/5.0075466 ↗
15. 10.1109/TED.2021.311866510.1109/TED.2021.3118665 ↗
16. 10.1029/95RG0026210.1029/95RG00262 ↗
17. United States Geological Survey (USGS). Mineral Commodity Summaries 2023; USGS: Reston, VA, 2023;10.3133/mcs2023.10.3133/mcs2023 ↗
18. 10.1103/PhysRevB.90.14010310.1103/PhysRevB.90.140103 ↗
19. 10.1016/j.apmt.2022.10166110.1016/j.apmt.2022.101661 ↗
20. 10.1039/D2NR05678J10.1039/D2NR05678J ↗
21. 10.1021/acsaelm.2c0060810.1021/acsaelm.2c00608 ↗
22. 10.1126/science.abm864210.1126/science.abm8642 ↗
23. 10.1002/adfm.20231182510.1002/adfm.202311825 ↗
24. 10.1039/D3TC01985C10.1039/D3TC01985C ↗
25. 10.1016/j.jeurceramsoc.2019.05.06510.1016/j.jeurceramsoc.2019.05.065 ↗
26. 10.1016/j.actamat.2020.11653610.1016/j.actamat.2020.116536 ↗
27. 10.1021/acsaelm.3c0011710.1021/acsaelm.3c00117 ↗
28. 10.1002/advs.20220739010.1002/advs.202207390 ↗
29. 10.1016/j.apmt.2022.10170810.1016/j.apmt.2022.101708 ↗
30. 10.1002/eem2.1250010.1002/eem2.12500 ↗
31. 10.1103/PhysRevMaterials.6.07440610.1103/PhysRevMaterials.6.074406 ↗
32. 10.1021/acsami.1c1587510.1021/acsami.1c15875 ↗
33. 10.1016/j.jmst.2021.07.01610.1016/j.jmst.2021.07.016 ↗
34. 10.1109/LED.2018.284657010.1109/LED.2018.2846570 ↗
35. Goh, Y.; Hwang, J.; Kim, M.; Jung, M.; Lim, S.; Jung, S. O.; Jeon, S. High Performance and Self-Rectifying Hafnia-Based Ferroelectric Tunnel Junction for Neuromorphic Computing and TCAM Applications. Proceedings of the 2021 IEEE International Electron Devices Meeting (IEDM); San Francisco, CA, Dec 11–16, 2021; pp 17.12.11–17.12.14,10.1109/IEDM19574.2021.9720610.10.1109/IEDM19574.2021.9720610 ↗
36. 10.1021/acsaelm.0c0067110.1021/acsaelm.0c00671 ↗
37. 10.1039/D0NR00933D10.1039/D0NR00933D ↗
38. 10.1109/TED.2020.299844410.1109/TED.2020.2998444 ↗
39. 10.1002/admt.20230014610.1002/admt.202300146 ↗
40. 10.1063/1.480467010.1063/1.4804670 ↗
41. 10.1109/LED.2019.293045810.1109/LED.2019.2930458 ↗
42. 10.1186/s11671-020-03353-610.1186/s11671-020-03353-6 ↗
43. 10.1109/TED.2021.313957010.1109/TED.2021.3139570 ↗
44. 10.1116/1.365838010.1116/1.3658380 ↗
45. 10.1103/PhysRevApplied.4.06401010.1103/PhysRevApplied.4.064010 ↗
46. 10.1002/adfm.20160059010.1002/adfm.201600590 ↗
47. 10.1002/aelm.20200072810.1002/aelm.202000728 ↗
48. 10.1002/adfm.20221497010.1002/adfm.202214970 ↗
49. 10.1107/S205252061900792310.1107/S2052520619007923 ↗
50. 10.1111/j.1151-2916.1985.tb10130.x10.1111/j.1151-2916.1985.tb10130.x ↗
51. 10.1016/j.sse.2007.09.03010.1016/j.sse.2007.09.030 ↗
52. 10.1126/science.adf613710.1126/science.adf6137 ↗
53. 10.1016/j.cap.2012.02.05010.1016/j.cap.2012.02.050 ↗
54. 10.1016/j.mee.2005.07.03010.1016/j.mee.2005.07.030 ↗
55. Wei, W.; Zhang, W. Q.; Tai, L.; Zhao, G. Q.; Sang, P. P.; Wang, Q. W.; Chen, F.; Tang, M. F.; Feng, Y.; Zhan, X. P.; Luo, Q.; Li, Y.; Chen, J. Z. In-Depth Understanding of Polarization Switching Kinetics in Polycrystalline Hf0.5Zr0.5O2 Ferroelectric Thin Film: A Transition from NLS to KAI. Proceedings of the 2021 IEEE International Electron Devices Meeting (IEDM); San Francisco, CA, Dec 11–16, 2021; pp 19.11.11–19.11.14,10.1109/IEDM19574.2021.9720664.10.1109/IEDM19574.2021.9720664 ↗
56. 10.1103/PhysRevLett.99.26760210.1103/PhysRevLett.99.267602 ↗
57. 10.1002/adfm.20210887610.1002/adfm.202108876 ↗
58. 10.1063/5.001348710.1063/5.0013487 ↗
59. 10.1002/pssr.20200048110.1002/pssr.202000481 ↗
60. 10.1038/s41578-022-00431-210.1038/s41578-022-00431-2 ↗
61. 10.1021/acsami.2c1536910.1021/acsami.2c15369 ↗
62. Wei, W.; Zhang, W. Q.; Wang, F.; Ma, X. L.; Wang, Q. W.; Sang, P. P.; Zhan, X. P.; Li, Y.; Tai, L.; Luo, Q.; Lv, H. B.; Chen, J. Z. Deep Insights into the Failure Mechanisms in Field-Cycled Ferroelectric Hf0.5Zr0.5O2 Thin Film: TDDB Characterizations and First-Principles Calculations. Proceedings of the 2020 IEEE International Electron Devices Meeting (IEDM); San Francisco, CA, Dec 12–18, 2020; pp 39.36.31–39.36.34,10.1109/IEDM13553.2020.9371932.10.1109/IEDM13553.2020.9371932 ↗
63. Liu, C.; Liu, F.; Luo, Q.; Huang, P.; Xu, X. X.; Lv, H. B.; Zhao, Y. D.; Liu, X. Y.; Kang, J. F. Role of Oxygen Vacancies in Electric Field Cycling Behaviors of Ferroelectric Hafnium Oxide. Proceedings of the 2018 IEEE International Electron Devices Meeting (IEDM); San Francisco, CA, Dec 1–5, 2018; pp 16.14.11–16.14.14,10.1109/IEDM.2018.8614540.10.1109/IEDM.2018.8614540 ↗
64. Chang, S. C.; Haratipour, N.; Shivaraman, S.; Brown-Heft, T. L.; Peck, J.; Lin, C. C.; Tung, I. C.; Merrill, D. R.; Liu, H.; Lin, C. Y.; Hamzaoglu, F.; Metz, M. V.; Young, I. A.; Kavalieros, J.; Avci, U. E. Anti-ferroelectric HfxZr1–xO2 Capacitors for High-density 3-D Embedded-DRAM. Proceedings of the 2020 IEEE International Electron Devices Meeting (IEDM); San Francisco, CA, Dec 12–18, 2020; pp 28.21.21–28.21.24,10.1109/IEDM13553.2020.9372011.10.1109/IEDM13553.2020.9372011 ↗
65. 10.1109/LED.2023.329094010.1109/LED.2023.3290940 ↗
66. Xiao, Y.; Xu, Y. X.; Deng, S.; Zhao, Z. J.; George, S.; Ni, K.; Narayanan, V. A Compact Ferroelectric 2T-(n+1)C Cell to Implement AND-OR Logic in Memory. Proceedings of the 2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI); Foz do Iguacu, Brazil, June 20–23, 2023; pp 1–6,10.1109/ISVLSI59464.2023.10238503.10.1109/ISVLSI59464.2023.10238503 ↗
67. Choi, W.; Kwak, M.; Heo, S.; Lee, K.; Lee, S.; Hwang, H. Hardware Neural Network Using Hybrid Synapses via Transfer Learning: WOx Nano-Resistors and TiOx RRAM Synapse for Energy-Efficient Edge-AI Sensor. Proceedings of the 2021 IEEE International Electron Devices Meeting (IEDM); San Francisco, CA, Dec 11–16, 2021; pp 23.21.21–23.21.24,10.1109/IEDM19574.2021.9720604.10.1109/IEDM19574.2021.9720604 ↗
68. 10.1109/LED.2021.306536710.1109/LED.2021.3065367 ↗
69. 10.1109/TED.2018.287982110.1109/TED.2018.2879821 ↗