Recent Advances in 1D Nanostructure Assembly and Direct Integration Methods for Device Applications

Abstract In recent years, 1D nanostructure‐based devices have achieved widespread usage in various fields, such as sensors, energy harvesters, transistors, and electrodes owing to their exceptional and distinct properties. The pioneering work of Dr. R. S. Wagner at Bell Laboratories in 1964 introduced the vapor–liquid–solid (VLS) process, a powerful synthesis method. Since then, numerous synthesis techniques, including sol–gel, hydrothermal, chemical vapor deposition (CVD), physical vapor deposition (PVD), and more, have been developed. These methods have enabled researchers to effectively control the shape (length and diameter) and material properties of nanowires. However, it was only about two decades ago that nanowires started to be widely utilized as key components in functional devices, primarily due to the lack of proper integration methods. Although dozens of integration techniques have been developed, none have emerged as a predominant choice, with each method presenting its own set of advantages and limitations. Therefore, this work aims to categorize these methods based on their working principles and provide a comprehensive summary of their pros and cons. Additionally, state‐of‐the‐art devices that capitalize on the integration of 1D nanomaterials are introduced.