journal article·2004-01

Correlation between deep depletion and current–voltage saturation of SrTiO3 gate dielectric capacitor

C.Y. Liu, T.Y. Tseng

Ceramics International· Volume 30· Issue 7
Publisher page

Abstract

Abstract SrTiO 3 (STO) gate dielectrics were deposited on p-type silicon substrate by radio-frequency (rf) magnetron sputtering in an Ar–O 2 and Ar–N 2 mixed ambient to form metal/insulator/semiconductor (MIS) capacitor to investigate capacitance–voltage ( C – V ) and current–voltage ( I – V ) characteristics. Schottky emission and Fowler–Nordheim tunneling mechanisms were responsible for the leakage current of nitrogen-grown STO-based MIS capacitors at the low and high electric field under accumulation condition, respectively, while the generation current dominated the leakage mechanism under the inversion condition due to the highly leaky insulator and the lack of electrons. The depletion width under the inversion condition would broaden to generate more electrons to maintain the leakage current and lead to capacitance decreasing under higher bias voltage, which is called as deep depletion. Therefore, the deep depletion and leakage current saturation under inversion condition would occur at the same time. The correlation between the deep depletion and the leakage mechanism in STO-based gate dielectric capacitor under inversion condition was used to extract the generation lifetime of silicon substrate. The normalized C – V measurements at 1 kHz under illumination were also made to examine the results of extracted generation lifetime. The extracted generation lifetime could provide a simple method to judge the quality of silicon substrates.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Semiconductor materials and devices · Electronic and Structural Properties of Oxides · Ferroelectric and Negative Capacitance Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (13)

Show source-provided references
1. International Technology Roadmap for Semiconductors, Semiconductor Industry Association, Austin, Texas, 2001.
2. Effects of oxygen–argon mixing on the electrical and physical properties of ZrTiO4 films sputtered on silicon at low temperature10.1063/1.360418 ↗
3. A. Chin, C.C. Liao, C.H. Lu, W.J. Chen, C. Tsai, Device and reliability of high-k Al2O3 gate dielectric with good mobility and low Dit, Symp. VLSI Tech. Dig. (1999) 135–136.10.1109/VLSIT.1999.799380 ↗
4. B.H. Lee, L. Kang, W.J. Qi, R. Nieh, Y. Jeon, K. Onishi, J.C. Lee, Ultrathin hafnium oxide with low leakage and excellent reliability for alternative gate dielectric application, Tech. Dig. Int. Electron Device Meeting (1999) 133–136.
5. A physical model for hysteresis phenomenon of the ultrathin ZrO2 film10.1063/1.1498964 ↗
6. Field effect transistors with SrTiO3 gate dielectric on Si10.1063/1.126023 ↗
7. Device modeling of ferroelectric memory field-effect transistor for the application of ferroelectric random access memory10.1109/TUFFC.2003.1176521 ↗
8. High-k gate dielectrics: current status and materials properties considerations10.1063/1.1361065 ↗
9. Effects of nitridation of silicon and repeated spike heating on the electrical properties of SrTiO3 gate dielectrics10.1063/1.1526914 ↗
10. Thickness-dependent stress effect in p-type metal-oxide-semiconductor structure injection current10.1063/1.1581004 ↗
11. S.M. Sze, Physics of Semiconductor Device, Wiley, New York, 1981.
12. E.H. Nicollian, J.R. Brews, MOS (Metal Oxide Semiconductor) Physics and Technology, Wiley, New York, 2003.
13. High field characteristics of metal-oxide-semiconductor capacitors with the silicon in inversion10.1063/1.352896 ↗