Optimization of electrophoretic deposition and thermal treatment of Cu–Mn spinel matrix for spinel/perovskite composite coating used as SOC metallic interconnect

The electrophoretic deposition of a mixture of copper-manganese spinel oxide matrix with perovskite oxide dispersion phase and subsequent two-step sintering was investigated as a means of obtaining a new spinel/perovskite composite coating for application in metallic interconnects for solid oxide cell (SOC) technologies. The effect of a number of factors was examined, including electrophoretic deposition parameters such as solvent type, time, voltage, and dispersant content as well as different heat treatment conditions on the quality of the matrix of the coating material. A solution of ethanol-acetone (25/75 v/v) and 2.0 g L−1 of iodine dispersant with a deposition time of 60 s and a voltage of 60 V provided the thickest, most uniform coating as deposited. SEM observations showed that a dense coating of Cu–Mn spinel was obtained after 8 h of reduction at 1000 °C followed by 6 h of oxidation at 850 °C. Selected preparation parameters were applied to deposit composite coatings with a Cu–Mn spinel matrix and the addition of LNF, LSC and LSCF perovskites.