Influence of the anti reflective coating on the electromigration resistance of 0.5 μm technology metal-2 line structures

journal article·1995-10

R. Stevens, A. Witvrouw, Ph.J. Roussel, K. Maex, H. Meynen, A. Cuthbertson

Applied Surface Science· Volume 91· Issue 1-4

Bibliographic record

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

OpenAlex topics: Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Show source-provided references

1. Forester · 1992 · 29

2. Colan · 1993 · 309 · 423

3. Inoue · 1994 · 275

4. Hewes · 1994 · 278

5. Besser · 1994 · 471