Deposition and study of CVD—tungsten and molybdenum thin films and their impact on microelectronics technology
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OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Semiconductor materials and interfaces
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References (7)
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3. Ellwanger · 1988 · II · 399
4. Sivaram · J. Vac. Sci. Technol. A · 1993 · 11 · 8710.1116/1.578724 ↗
5. Gesheva · J. Phys. (Paris) III · 1992 · 8
6. J. Phys. (Paris) IV
7. Pauleau · Thin Solid Films · 1984 · 122 · 24310.1016/0040-6090(84)90051-8 ↗