journal article·1992

The catastrophic phase of electromigration: surface diffusion, island formation, and film thinning

R.W. Vook, C.Y. Chang

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and devices · Molecular Junctions and Nanostructures

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References (9)

Show source-provided references
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2. Chang · 1991 · Vol. 225
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4. Blech · J. Appl. Phys. · 1969 · 40 · 48510.1063/1.1657425 ↗
5. Berenbaum · J. Appl. Phys. · 1971 · 42 · 88010.1063/1.1660116 ↗
6. Vávra · Phys. Status Solidi (a) · 1981 · 63 · 36310.1002/pssa.2210630147 ↗
7. Lobotka · Phys. Status Solidi (a) · 1981 · 63 · 65510.1002/pssa.2210630233 ↗
8. Vávra · Phys. Status Solidi (a) · 1981 · 65 · K10710.1002/pssa.2210650246 ↗
9. Chang · Vacuum · 1990 · 41 · 143410.1016/0042-207X(90)93981-N ↗