journal article·2025-08

Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization

Minjeong Kweon, Chaehyun Park, Debananda Mohapatra, Sang Bok Kim, Jong-Seong Bae, Taehoon Cheon, Soo-Hyun Kim

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OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · Metal and Thin Film Mechanics

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