Effect of Ar ion beam treatment on the interfacial adhesion between a fluorinated ethylene propylene (FEP) film and sputtered Cu
Source abstract
Abstract
• Fluorinated ethylene propylene (FEP) was surface-modified by Ar ion beam treatment. • Ar ion beam treatment significantly strengthened Cu/FEP interfacial adhesion. • Ductile fracture initiated exclusively within the FEP layer in all treated films. • Improving Cu/FEP interfacial adhesion was attributed to formation of nanostructures and increased crystallinity on FEP. Low-loss flexible copper-clad laminates are required for next-generation ultra-high-frequency communication systems, and fluorinated polymers are one of the good dielectric candidates due to its excellent dielectric properties. However, this necessitates ensuring high adhesion between Cu and the fluorinated polymers that commonly indicate surface inertness. This study investigates the effects of Ar ion beam treatment on the interfacial adhesion between fluorinated ethylene propylene (FEP) films and Cu layers deposited via magnetron sputtering. We increased the accumulated Ar ion dose from 9.8 × 10 14 to 8.6 × 10 15 ions/cm 2 , and the maximum peel strength between FEP and Cu was recorded to be 7.4 ± 0.26 N/cm at an ion dose of 5.9 × 10 15 ions/cm 2 on FEP. Surface characterization revealed that in all samples, the initial delamination occurred within the FEP surface, regardless of the Ar ion dose. Interfacial adhesion of Cu/FEP was attributed to the reinforced mechanical properties of the FEP via increased surface roughness and crystallinity. These findings will contribute to ensuring the reliable interfacial adhesion of Cu/FEP systems for high-frequency communications.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Copper Interconnects and Reliability · Surface Modification and Superhydrophobicity
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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