SIMS microprofiles of Pb5%Sn solder joints in electronic devices after accelerated life tests
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Abstract
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Integrated Circuits and Semiconductor Failure Analysis · Microstructure and mechanical properties
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References (21)
Show source-provided references
1. Kitano · 1987 · 235
2. Frear · 1986 · 72 · 181
3. O'Clock · IEEE Trans. Components Hybrids Manuf. Technol. CHMT-7 · 1984 · 314
4. Solomon · IEEE Trans. Components Hybrids Manuf. Technol. CHMT-9 · 1984 · 423
5. Frear · 1987 · 269
6. Hirth · Acta Met. · 1985 · 33 · 25910.1016/0001-6160(85)90078-1 ↗
7. Frear · IEEE Trans. Components Hybrids Manuf. Technol. CHMT-13 · 1990 · 71810.1109/33.62585 ↗
8. Kang · J. Mater. Res. · 1993 · 8 · 103310.1557/JMR.1993.1033 ↗
9. Frost · IEEE Trans. Components Hybrids Manuf. Technol. CHMT-13 · 1990 · 72710.1109/33.62586 ↗
10. Frost · 1987 · 259
11. Konetzki · J. Mater. Res. · 1988 · 3 · 46610.1557/JMR.1988.0466 ↗
12. Konetzki · J. Mater. Res. · 1989 · 4 · 142110.1557/JMR.1989.1421 ↗
13. Zhang · J. Electrochem. Soc. · 1990 · 133 · 315810.1149/1.2086180 ↗
14. Opila · J. Vac. Sci. Technol. A · 1986 · 4 · 17310.1116/1.573466 ↗
15. Oberschmidt · J. Appl. Phys. · 1982 · 53 · 567210.1063/1.331452 ↗
16. Scandurra · J. Mater. Res. · 1992 · 7 · 239510.1557/JMR.1992.2395 ↗
17. Scandurra · 1992 · 264 · 257
18. Bray · 1992 · 253
19. S.G.S.-Thomson Microelectronics Internal Communication.
20. Marwick · J. Nucl. Mater. · 1979 · 83 · 3610.1016/0022-3115(79)90589-0 ↗
21. Lawson · J. Mater. Res. · 1993 · 8 · 74510.1557/JMR.1993.0745 ↗