Surface dispersion hardening Cu matrix alloy

Abstract An aluminizing and internal oxidation technique had been used in hardening the surface of pure copper. The aluminum concentration distribution in aluminized layer, microstructure and some properties of surface hardening layer were studied. Results show that the aluminum concentration in surface of aluminized layer approaches aluminum content in the aluminized agent, the aluminized layer depth reached is 100 μm. It is possible to generate Al2O3 particles dispersed hardening layer in the surface of pure copper with aluminizing and oxidation technique, the amount of Al2O3 particles in surface hardening layer also effects the microhardness, the specific resistance, and wear resistance of the prepared copper matrix alloys.