journal article·1990-02

Thin-film growth of Sn On Cu(100)

F. Abel, C. Cohen, J.A. Davies, J. Moulin, D. Schmaus

Applied Surface Science· Volume 44· Issue 1
Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Surface and Thin Film Phenomena

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (10)

Show source-provided references
1. 1958 · 634
2. Correa da Silva · Trans. Am. Inst. Min. Eng. · 1951 · 191 · 155
3. Dyson · J. Appl. Phys. · 1967 · 38 · 340810.1063/1.1710127 ↗
4. Argile · Surf. Sci. · 1983 · 135 · 1810.1016/0039-6028(83)90207-8 ↗
5. 1967 · Vol. 2
6. Boulliard · Phys. Rev. B · 1984 · 30 · 247010.1103/PhysRevB.30.2470 ↗
7. Cohen · Nucl. Instr. Meth. · 1983 · 218 · 14710.1016/0167-5087(83)90970-5 ↗
8. Tu · Acta Met. · 1982 · 30 · 94710.1016/0001-6160(82)90201-2 ↗
9. Tu · Acta Met. · 1973 · 21 · 34710.1016/0001-6160(73)90190-9 ↗
10. Doolittle · Nucl. Instr. Methods B · 1985 · 9 · 34410.1016/0168-583X(85)90762-1 ↗