Fabrication and characterization of metal/GaN contacts
Source abstract
Abstract
Abstract In this paper, the formation of ohmic contacts to n-GaN using Al, Ti/Al and Ti/Au has been investigated. n-GaN Ti/Al contacts showed the lowest specific contact resistance after annealing at 900°C for 30 s. For p-GaN, Ni/Au contacts were studied. A lowering of sheet resistance upon annealing in the case of n-GaN and an increase for p-GaN might be attributed to formation of N-vacancy. No native oxide was detected on GaN surface by XPS.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: GaN-based semiconductor devices and materials · Metal and Thin Film Mechanics · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (18)
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