A mathematical model for material removal and chemical–mechanical synergy in chemical–mechanical polishing at molecular scale

Abstract This paper presents a mathematical material removal model based on the chemical and mechanical synergistic effects in the chemical–mechanical polishing (CMP) process. It seems to explain the transition from a chemically dominant region to a mechanically dominant region. In addition, this model predicts the effects of most variables involved in the CMP process including the processing conditions (velocity, downpressure), pad properties (modulus, hardness and asperity sizes) and slurry characteristics (particle size, concentration and distribution). The results reveal some insights into the micro-contact and wear mechanisms of the CMP process.