Strain transfer through film-substrate interface and surface curvature evolution during a tensile test
Source abstract
Abstract
Abstract Uniaxial tensile tests on polyimide-supported thin metal films are performed to respectively study the macroscopic strain transfer through an interface and the surface curvature evolution. With a dual digital image correlation (DIC) system, the strains of the film and the substrate can be simultaneously measured in situ during the tensile test. For the true strains below 2% (far beyond the films’ elastic limit), a complete longitudinal strain transfer is present irrespective of the film thickness, residual stresses and microstructure. By means of an optical surface profiler, the three-dimensional (3D) topography of film surface can be obtained during straining. As expected, the profile of the specimen center remains almost flat in the tensile direction. Nevertheless, a relatively significant curvature evolution (of the same order with the initial curvature induced by residual stresses) is observed along the transverse direction as a result of a Poisson's ratio mismatch between the film and the substrate. Furthermore, finite element method (FEM) has been performed to simulate the curvature evolution considering the geometric nonlinearity and the perfect strain transfer at the interface, which agrees well with the experimental results.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Optical measurement and interference techniques · Advanced Fiber Optic Sensors · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (48)
Show source-provided references
1. Combined synchrotron X-ray and image-correlation analyses of biaxially deformed w/cu nanocomposite thin films on kapton
2. Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations
3. Micromechanics of macroelectronics
4. Materials and mechanics for stretchable electronics
5. High ductility of a metal film adherent on a polymer substrate
6. Ductility of thin metal films on polymer substrates modulated by interfacial adhesion
7. Evaluation of structure and mechanical properties of ni-rich niti/kapton composite film
8. Probing the effects of nanoscale architecture on the mechanical properties of hexagonal silica/polymer composite thin films
9. Elastic modulus of amorphous ge2sb2te5 thin film measured by uniaxial microtensile test
10. Adhesion energies of cr thin films on polyimide determined from buckling: experiment and model
11. Fracture and cracking phenomena in thin films adhering to high-elongation substrates
12. Cracking phenomena of brittle films in nanostructure composites analysed by a modified shear lag model with residual strain
13. Stress transfer through fully bonded interface of layered materials
14. Determination of elastic constants of a fiber-textured gold film by combining synchrotron X-ray diffraction and in situ tensile testing
15. A new method to study cyclic deformation of thin films in tension and compression
16. Comparative study of the mechanical properties of nanostructured thin films on stretchable substrates
17. Mastering the biaxial stress state in nanometric thin films on flexible substrates
18. Elastic-strain distribution in metallic film-polymer substrate composites
19. Experimental determination of the strain transfer across a flexible intermediate layer in thin film structures as a function of flexible layer thickness
20. Experimental determination of the strain transfer across a flexible intermediate layer in thin-film structures
21. Hauk · 1997
22. Study of texture effect on elastic properties of au thin films by X-ray diffraction and in situ tensile testing
23. Displacement discontinuity or complex shape of sample: assessment of accuracy and adaptation of local dic approach
24. Digital image correlation: from displacement measurement to identification of elastic properties-a review
25. The influence of cylindrical geometry on X-ray stress tensor analysis. I. General formulation
26. The influence of cylindrical geometry on X-ray stress tensor analysis. II. Applications
27. Freund · 2004
28. Residual stress/strain analysis in thin films by X-ray diffraction
29. The tension of metallic films deposited by electrolysis
30. Celebrating the 100th anniversary of the stoney equation for film stress: developments from polycrystalline steel strips to single crystal silicon wafers
31. Overview and applicability of residual stress estimation of film-substrate structure
32. Full-field optical measurement of curvatures in ultra-thin-film-substrate systems in the range of geometrically nonlinear deformations
33. Substrate curvature due to thin film mismatch strain in the nonlinear deformation range
34. Non-uniform, axisymmetric misfit strain: in thin films bonded on plate substrates/substrate systems: the relation between non-uniform film stresses and system curvatures
35. Warpage analysis of electroplated cu films on fiber-reinforced polymer packaging substrates
36. Exploring pd-si (001) and pd-si (111) thin-film reactions by simultaneous synchrotron X-ray diffraction and substrate curvature measurements
37. Stress buildup during crystallization of thin chalcogenide films for memory applications: in situ combination of synchrotron X-ray diffraction and wafer curvature measurements
38. Controlled nanostructuration of polycrystalline tungsten thin films
39. Internal stresses in cr, mo, ta, and pt films deposited by sputtering from a planar magnetron source
40. Strain measurement by digital image correlation: influence of two types of speckle patterns made from rigid or deformable marks
41. Assessment of digital image correlation measurement errors: methodology and results
42. Study on young's modulus of thin films on kapton by microtensile testing combined with dual dic system
43. Application of optical methods to investigate the non-linear asymmetric behavior of ceramics exhibiting large strain to rupture by four-points bending test
44. Deposition of ultra-thin gold film on in situ loaded polymeric substrate for compression tests
45. A comparison of surface metrology techniques
46. Digital image correlation of metal nanofilms on su-8 for flexible electronics and mems
47. H. Wei, P. O. Renault, E. L. Bourhis, S. Wang, P. Goudeau, Cyclic testing of thin ni films on a pre-tensile compliant substrate, Materials Science & Engineering A.
48. The influence of a brittle cr interlayer on the deformation behavior of thin cu films on flexible substrates: experiment and model