The influence of non-ionic surfactants on laser-induced copper deposition
Source abstract
Abstract
Abstract We describe the laser-induced chemical liquid phase deposition of copper using a solution containing a non-ionic surfactant on substrates comprising either an oxide glass or a glass-ceramic Sitall. Our results demonstrate that the addition of the surfactant to the deposition solution results in improved structural topology in the deposited copper layer. Our data confirm that the use of a non-ionic surfactant can reduce the negative influence of gas formation during the deposition process.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic and Structural Properties of Oxides · Laser-Ablation Synthesis of Nanoparticles · Copper-based nanomaterials and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (15)
Show source-provided references
1. Laser-induced chemical liquid phase deposition of metals: chemical reactions in solution and activation of dielectric surfaces10.1070/RC2011v080n09ABEH004224 ↗
2. Laser-assisted chemical liquid-phase deposition of metals for micro-, optoelectronics
3. Laser direct writing of copper on polyimide surfaces from solution10.1016/S0169-4332(99)00455-9 ↗
4. Laser-induced chemical liquid deposition of discontinuous and continuous copper films10.1016/j.surfcoat.2006.10.019 ↗
5. Laser-assisted metal deposition from CuSO4-based electrolyte solution10.1002/lapl.200610090 ↗
6. Composition of the gas phase formed upon laser-induced copper deposition from solutions10.1016/j.mencom.2011.01.014 ↗
7. Side reactions during laser-induced deposition of copper from aqueous solutions of CuII complexes10.1007/s11172-012-0133-3 ↗
8. Effect of surfactants on the laser-induced copper deposition from solutions
9. Galvanostatic studies of the nucleation and growth kinetics of copper in the presence of surfactants10.1016/0013-4686(95)00241-6 ↗
10. Electroless copper deposition for ULSI10.1016/0040-6090(95)05836-2 ↗
11. On stabilization of physical development solutions
12. Optimization of the solution composition for laser-induced chemical liquid phase deposition of copper10.1007/s11172-011-0232-6 ↗
13. Sorbitol as an efficient reducing agent for laser-induced copper deposition10.1016/j.apsusc.2012.06.085 ↗
14. Christian · 2002
15. Adamson · 1997