Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints
Source abstract
Abstract
Abstract Herein, we investigated the interfacial reactions of crystalline Pd (pure Pd) and amorphous Pd (Pd(P)) layers in thin electroless-Ni electroless-Pd immersion-Au (thin-ENEPIG) surface-finished printed circuit board with Sn-3.0Ag-0.5Cu (SAC305) solder joints reflowed at 260 °C for 10–180 s. After 20 s reflow, a thick (Pd,Au)Sn4 IMC was formed at the interface of the pure Pd joint, while thick AuSn4 and thin (Pd,Au)Sn4 IMCs were formed at the interface of the Pd(P) joint. After 30 s reflow, needle-type (Cu,Ni)6Sn5 IMC was mainly formed at the top-side interface of the pure Pd joint, while scallop-type (Cu,Ni)6Sn5 IMC was formed at the top-side interface of Pd(P) joints. Finally, the top-side (Cu,Ni)6Sn5 IMC of the pure Pd and the top- and bottom-side (Cu,Ni)6Sn5 IMCs of the Pd(P) joints coarsened with increasing reflow time up to 180 s. In the results of top-view SEM micrographs, the (Cu,Ni)6Sn5 IMCs on the Pd(P) joint were larger than those on the pure Pd joint for reflow times of 30–180 s. Therefore, P in the Pd layer was concluded to significantly affect the interfacial reactions and IMC morphology of the SAC 305 solder with ENEPIG joints during reflow reactions.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Semiconductor materials and interfaces
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (40)
Show source-provided references
1. Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints10.1063/1.2359135 ↗
2. Thermomechanical studies of surface mounted microelectronics by finite element analysis10.1016/j.compositesb.2018.12.151 ↗
3. Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects10.1007/s11664-010-1352-8 ↗
4. Materials, processing and reliability of low temperature bonding in 3D chip stacking10.1016/j.jallcom.2018.04.040 ↗
5. Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy10.1016/j.microrel.2012.07.029 ↗
6. Advanced in lead-free electronics soldering10.1016/S1359-0286(00)00036-X ↗
7. Properties of lead-free solder alloys with rare earth element additions10.1016/j.mser.2004.01.001 ↗
8. Y. Zhang, Z. Cai, J.C. Suhling, P. Lall, M.J. Bozack, The effects of aging temperature on SAC solder joint material behavior and reliability, in: Proceedings – Electronic Components and Technology Conference 2008, 2008, 99–112 http://doi.org/10.1109/ECTC.2008.4549956.10.1109/ECTC.2008.4549956 ↗
9. Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging10.1007/s11664-999-0159-y ↗
10. A review of mechanical properties of lead-free solders for electronic packaging10.1007/s10853-008-3125-9 ↗
11. Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging10.1016/S0254-0584(01)00298-X ↗
12. Six cases of reliability study of Pb-free solder joints in electronic packaging technology10.1016/S0927-796X(02)00007-4 ↗
13. An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate10.1007/s11664-008-0545-x ↗
14. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate10.1007/BF02692576 ↗
15. Microstructure evolution of eutectic Sn-Ag solder joints10.1007/BF02651371 ↗
16. Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys10.1007/s11664-006-0189-7 ↗
17. The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure10.1007/s11664-001-0144-6 ↗
18. Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder10.1016/j.jallcom.2005.03.053 ↗
19. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products10.1016/j.microrel.2011.07.093 ↗
20. Characteristics of intermetallics and micromechanical properties during thermal aging of Sn-Ag-Cu flip-chip solder interconnects10.1016/j.msea.2004.10.007 ↗
21. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints10.1016/S0925-8388(02)01166-0 ↗
22. IMC growth and shear strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA joints during aging10.2320/matertrans.45.727 ↗
23. Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish10.1007/s11664-001-0143-7 ↗
24. W.H. Zhu, J.H.L. Pang, X.R. Zhang, E. Poh, Y.F. Sun, A.Y.S. Sun, C.K. Wang, H.B. Tan, in: Proceedings – Electronic Components and Technology Conference 2008, 2008, pp. 1667–1672. http://doi.org /10.1109/ECTC.2008.4550202.10.1109/ECTC.2008.4550202 ↗
25. Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling10.1016/j.jallcom.2006.12.098 ↗
26. Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction10.1016/j.jallcom.2004.12.009 ↗
27. Comparative study of ENIG and ENEPIG as surface finishes for a Sn-Ag-Cu solder joint10.1007/s11664-011-1686-x ↗
28. Correlation between microstructure evolution and mechanical strength in the Sn-3.0Ag-0.5Cu/ENEPIG solder joint10.1016/j.msea.2013.05.058 ↗
29. Effect of thickness and phosphorus content on Au/Pd/Ni(P) metal finish of printed circuit board10.1007/s11664-013-2609-9 ↗
30. Sn–Ag–Cu solder reaction with Au/Pd/Ni(P) and Au/Pd(P)/Ni(P) platings10.1016/j.tsf.2012.12.070 ↗
31. Field-emission transmission electron microscopy study of the reaction sequence between Sn–Ag–Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging10.1016/j.tsf.2012.07.076 ↗
32. Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength10.1016/j.msea.2014.05.049 ↗
33. Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P IMC10.1007/s10853-012-7070-2 ↗
34. Interfacial microstructure and mechanical reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) reactive system: P content effects10.1016/j.surfcoat.2018.04.014 ↗
35. Effects of Ni layer thickness of thin–ENEPIG surface finishes on the interfacial reactions and shear strength of Sn–3.0Ag–0.5Cu solder joints during aging10.1007/s10854-019-01653-x ↗
36. Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints10.1007/s10854-017-8426-9 ↗
37. Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad10.1016/j.tsf.2014.12.026 ↗
38. Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints10.1016/j.jallcom.2019.07.184 ↗
39. Roles of phosphorous in Sn4Ag0.5Cu solder reaction with electrolytic Ni–Au10.1016/j.jallcom.2012.06.020 ↗
40. Detailed phase evolution of a phosphorous-rich layer and formation of the Ni-Sn-P compound in Sn-Ag-Cu/electroplated Ni-P solder joints10.1007/s11664-009-1014-x ↗