journal article·2018-03

Electrodeposition of nickel-iridium alloy films from aqueous solutions

Wangping Wu, Jinjin Jiang, Peng Jiang, Zhizhi Wang, Ningyi Yuan, Jianning Ding

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Abstract

Abstract Nickel–iridium (Ni-Ir) alloy films were electrodeposited from aqueous solutions on copper substrates under galvanostatic conditions. The effects of bath composition and deposition time on the faradaic efficiency (FE), partial current densities, chemical composition, morphology and crystallographic structure of the films were studied. The results show that the Ni–Ir alloys with Ir content as high as 37 at% and FE as high as 44% were obtained. Increase in concentration of citric acid had little or no effect on the composition of the alloys, but resulted in a significant decrease in FE and partial current densities of Ni and Ir. The FE and the partial current density of Ni slightly decreased with increasing Ir3+ concentration, however, Ir content increased while partial current density of Ir remained stable. The increase of Ni2+ concentration could result in the increase of the FE and the rate of Ni–Ir deposition, and even no cracks formed on the surface. The surface average roughness and root mean square roughness of the film were 6.8 ± 0.3 nm and 5.4 ± 0.3 nm, respectively. The mixture phases contained significant amounts of Ni oxides and a small amount of metallic Ni, Ir and Ir oxides on the surface. After argon ion sputter cleaning, the film was mainly composed of metallic Ni and Ir. The film consisted of the amorphous and nanocrystalline phases. The Ni content in the deposits was higher than that in the electrolyte, the co-deposition of Ni–Ir alloy was a normal deposition.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electrodeposition and Electroless Coatings · Copper Interconnects and Reliability · Semiconductor materials and interfaces

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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