Surface modifying of SiC particles and performance analysis of SiCp/Cu composites
Source abstract
Abstract
Abstract In this study, the electroless copper plating method was applied to deposit a Cu coating on SiCp in order to improve interface bonding performance. The SiCp surface morphology with uncoated and coated copper was investigated. The SiCp/Cu composite was fabricated by the hot-pressed sintering technology. SiC particles with various contents were used as reinforcement. The results showed that the distribution of reinforced particle with electroless plating copper coating was uniform in the copper matrix. The SiCp content played had an important role on thermal expansion coefficient and wear properties behaviors of the SiCp/Cu composites. The wear resistance capacity and thermal expansion coefficient of the composites decreased with increasing amount of SiC. Compared with the pure Cu matrix, the obtained SiCp/Cu composites had better capacity of the wear resistance. The SiCp/Cu composites increased when compared with the pure Cu material.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Aluminum Alloys Composites Properties · Corrosion Behavior and Inhibition
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (16)
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