journal article·2008-07

Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition

Shunsuke Nishimoto, Atsushi Kubo, Xintong Zhang, Zhaoyue Liu, Noriaki Taneichi, Toshiki Okui, Taketoshi Murakami, Takashi Komine, Akira Fujishima

Applied Surface Science· Volume 254· Issue 18
Publisher page

Abstract

Abstract A hydrophobic/super-hydrophilic pattern was prepared on a TiO2 thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag+ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer (SAM), and (5) photocatalytic decomposition of selected areas of the SAM. A hydrophobic/super-hydrophilic pattern with 500-μm2 hydrophilic areas was obtained in this process. It is particularly noteworthy that a UV irradiation time of only 1 s was sufficient for the nucleation step in the patterning process.
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Research context

OpenAlex topics: Copper-based nanomaterials and applications · Advanced Photocatalysis Techniques · Electrophoretic Deposition in Materials Science

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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