Replication of mold for UV-nanoimprint lithography using AAO membrane
Source abstract
Abstract
Abstract A simple and highly effective method to the replication of soft mold based on the anodic aluminum oxide (AAO) membrane was developed. The soft mold with nanopillar arrays was composed of the toluene diluted PDMS layer supported by the soft PDMS. A water contact angle as high as 114° was achieved. The hexagonally well-order arrays of holes of nanometer dimensions, ∼100 nm pore diameter and 125 nm center-to-center pore, could be gained over large areas by UV-nanoimprint lithography (UV-NIL) with the replicated soft PDMS mold. It is expected that the developed soft mold would find applications in light emitting diodes devices.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Nanofabrication and Lithography Techniques · Anodic Oxide Films and Nanostructures · Advancements in Photolithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (28)
Show source-provided references
1. Chou · Science · 1996 · 272 · 8510.1126/science.272.5258.85 ↗
2. Bender · Microelectron. Eng. · 2000 · 53 · 23310.1016/S0167-9317(00)00304-X ↗
3. Guo · Adv. Mater. · 2007 · 19 · 49510.1002/adma.200600882 ↗
4. Sotomayor · Mater. Sci. Eng. C · 2003 · 23 · 2310.1016/S0928-4931(02)00221-7 ↗
5. Meneou · J. Vac. Sci. Technol. B · 2008 · 26 · 15610.1116/1.2823035 ↗
6. Voisin · Microelectron. Eng. · 2007 · 84 · 96710.1016/j.mee.2007.01.086 ↗
7. Jung · Nano. Lett. · 2006 · 6 · 35110.1021/nl052110f ↗
8. Namil Koo · Nanotechnology · 2008 · 19 · 22530410.1088/0957-4484/19/22/225304 ↗
9. Bender · J. Vac. Sci. Technol. B · 2004 · 22 · 322910.1116/1.1824057 ↗
10. Xia · Angew. Chem. Int. Ed. · 1998 · 37 · 55010.1002/(SICI)1521-3773(19980316)37:5<550::AID-ANIE550>3.0.CO;2-G ↗
11. Odom · Langmuir · 2002 · 18 · 531410.1021/la020169l ↗
12. Fua · Nano Lett. · 2004 · 4 · 246710.1021/nl048355u ↗
13. Zhang · Small · 2006 · 2 · 144010.1002/smll.200600255 ↗
14. Jewell · New J. Phys. · 2007 · 9 · 9910.1088/1367-2630/9/4/099 ↗
15. Sun · Appl. Phys. Lett. · 2008 · 32 · 06111210.1063/1.2870080 ↗
16. Kustandi · Adv. Funct. Mater. · 2007 · 17 · 221110.1002/adfm.200600564 ↗
17. B.C. Englert, J.W. Wu, C.P. Wong, 11th International Symposium on Advanced Packaging Materials Processes, Properties, and Interfa (IEEE Cat. No. 06TH8875), 2006.
18. Liang · Am. Chem. Soc. · 2004 · 126 · 1633810.1021/ja044545v ↗
19. Lee · Chem. Mater. · 2001 · 13 · 238710.1021/cm0014076 ↗
20. Dickey · ACS Nano · 2008 · 2 · 80010.1021/nn800036r ↗
21. Deb · Nano Lett. · 2005 · 5 · 184710.1021/nl0510762 ↗
22. Masuda · Jpn. J. Appl. Phys. · 2000 · 9 · L103910.1143/JJAP.39.L1039 ↗
23. Jianyu · J. Appl. Phys. · 2002 · 91 · 254410.1063/1.1433173 ↗
24. Crouse · Appl. Phys. Lett. · 2000 · 76 · 4910.1063/1.125652 ↗
25. Masuda · Science · 1995 · 268 · 146610.1126/science.268.5216.1466 ↗
26. Koo · Microelectron. Eng. · 2007 · 84 · 90410.1016/j.mee.2007.01.017 ↗
27. Roman · Anal. Chem. · 2005 · 77 · 141410.1021/ac048811z ↗
28. Byeon · Microelectron. Eng. · 2008 · 85 · 83010.1016/j.mee.2007.12.078 ↗