Autohesion of semi-crystalline PEEK near and under the glass transition temperature
Source abstract
Abstract
Abstract Autohesion of semi-crystalline polymers under the glass transition temperature (Tg) is fundamentally difficult due to severe restriction in molecular chain mobility. We demonstrate that enhanced autohesion of semi-crystalline polyetheretherketone (PEEK) at temperatures close or under Tg can be achieved through plasma immersion ion implantation (PIII) treatment. Autohesive bonding strength of PEEK increased linearly with PIII bias voltage up to tenfold compared to untreated controls at 160 °C (Tg +10 °C). At 130 °C (Tg −20 °C), PIII treatment increased bonding strength of PEEK by more than fivefold compared to the untreated control. PIII treated surface exhibited higher surface energy, polar component and oxygen content. A model based on the formation of covalent bonds on the plasma treated PEEK by radicals present at the interface was found to predict the bonding strength above and below Tg. The major mechanism responsible for improved autohesion of PEEK near and under Tg is believed to be free radicals based covalent bonding assisted by an increase of surface wettability and reduction in surface crystal structure as was evidenced by SEM images.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Polymer Nanocomposite Synthesis and Irradiation · Diamond and Carbon-based Materials Research · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (30)
Show source-provided references
1. Becker · Talanta · 2002 · 56 · 26710.1016/S0039-9140(01)00594-X ↗
2. Velten · IEEE Transactions on Advanced Packaging · 2005 · 28 · 53310.1109/TADVP.2005.858427 ↗
3. Amanat · Medical Engineering & Physics · 2010 · 32 · 69010.1016/j.medengphy.2010.04.011 ↗
4. Kurtz · Biomaterials · 2007 · 28 · 484510.1016/j.biomaterials.2007.07.013 ↗
5. Sereno · European Medical Device Technology · 2010 · 1 · 22
6. Tsao · Microfluidics and Nanofluidics · 2009 · 6 · 110.1007/s10404-008-0361-x ↗
7. Grodzinski · Biomedical Microdevices · 2001 · 3 · 27510.1023/A:1012400629650 ↗
8. Voyutskii · 1963
9. Cho · Journal of Applied Polymer Science · 1995 · 56 · 143510.1002/app.1995.070561106 ↗
10. Awaja · Progress in Polymer Science · 2009 · 34 · 94810.1016/j.progpolymsci.2009.04.007 ↗
11. Zhang · Colloids and Surfaces A: Physicochemical and Engineering Aspects · 2011 · 374 · 8810.1016/j.colsurfa.2010.11.013 ↗
12. Awaja · Plasma Processes and Polymers · 2010 · 7 · 86610.1002/ppap.201000018 ↗
13. Awaja · Applied Physics Letters · 2011 · 98 · 21150410.1063/1.3592259 ↗
14. Boiko · Macromolecules · 1998 · 31 · 662010.1021/ma9610368 ↗
15. Boiko · Journal of Polymer Science Part B: Polymer Physics · 2004 · 42 · 186110.1002/polb.20077 ↗
16. Boiko · Mechanics of Composite Materials · 2003 · 39 · 8910.1023/A:1022995807693 ↗
17. Boiko · Polymer · 2004 · 45 · 854110.1016/j.polymer.2004.10.021 ↗
18. Boiko · Polymer · 2001 · 42 · 869510.1016/S0032-3861(01)00406-2 ↗
19. Thomas · 2005
20. Awaja · Plasma Processed and Polymers · 2010 · 7 · 101010.1002/ppap.201000072 ↗
21. Awaja · Plasma Processes and Polymers · 2012 · 9 · 17410.1002/ppap.201100056 ↗
22. Powles · Surface and Coating Technology · 2007 · 201 · 796110.1016/j.surfcoat.2007.03.030 ↗
23. Powles · Diamond and Related Materials · 2005 · 14 · 157710.1016/j.diamond.2005.02.013 ↗
24. Bilek · Nuclear Instruments and Methods in Physics Research B · 2006 · 242 · 22110.1016/j.nimb.2005.08.178 ↗
25. Dole · Journal of the American Chemical Society · 1953 · 75 · 608210.1021/ja01119a544 ↗
26. Radiation resistance of polymers and composites
27. Kondyurin · Polymer Degradation and Stability · 2009 · 94 · 63810.1016/j.polymdegradstab.2009.01.004 ↗
28. Lai · Applied Surface Science · 2006 · 252 · 337510.1016/j.apsusc.2005.05.038 ↗
29. Schiller · Surface and Coating Technology · 2004 · 48310.1016/S0257-8972(03)00916-2 ↗
30. Dworecki · Nuclear Instruments and Methods in Physics Research Section B · 2004 · 225 · 48310.1016/j.nimb.2004.05.024 ↗