journal article·1996-10

Direct writing of gold and copper lines from solutions

M. Wehner, F. Legewie, B. Theisen, E. Beyer

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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Research context

OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · Advanced Surface Polishing Techniques

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References (10)

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