Effects of the melt state on the microstructure of a Sn–3.5%Ag solder at different cooling rates
Source abstract
Abstract
Abstract The effects of the melt state on the microstructure of Sn–3.5%Ag solder were investigated at two different cooling rates. The results show the solid–liquid interface energy is found to increase when the alloy is melted at above liquid–liquid structure transition (L-LST) temperature. Consequently, the melts require a larger undercooling to nucleate and a slower rate to grow. Finally, the solidification microstructures of the Sn–3.5%Ag alloy are refined. During L-LST, the eutectic growth pattern changes from a metastable cellular eutectic growth into a rod-like regular eutectic in some grains. L-LST refines the microstructure, inevitably leading to increased microhardness. At different cooling rates, the effects of the melt state on the microstructure and microhardness of Sn–3.5%Ag solder are similar.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Solidification and crystal growth phenomena · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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