Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper
Source abstract
Abstract
Abstract In this paper the influence of the epoxy roughness, surface modifications and ELD (electroless copper deposition) temperatures on the adhesive strength of the copper is studied. Good adhesion at low roughness values is targeted due to their applicability in high density electronic circuits. Roughened epoxy surfaces are modified with adsorbed polyamines, polydopamine and polyamines grafted to polydopamine. Next the, adhesive strength of ELD copper is determined with peel strength measurements and the interphases are examined with SEM (scanning electron microscopy). Polydopamine and polyamines grafted to polydopamine can lead to increased adhesive strength at lower roughness values compared to the non-modified samples at specific plating temperatures.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Polymer Surface Interaction Studies · Molecular Junctions and Nanostructures · Corrosion Behavior and Inhibition
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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