Overcoming Ce–O–Si bonding: A pre-cleaning strategy for removing ceria particles on wafer surface after chemical mechanical polishing
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OpenAlex topics: Advanced Surface Polishing Techniques · Fluid Dynamics and Thin Films · Minerals Flotation and Separation Techniques
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References (52)
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1. Enhanced open innovation: CMP innovation to open new paradigm10.1149/2.0161905jss ↗
2. Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning10.1116/1.590901 ↗
3. Chemical processes in glass polishing10.1016/0022-3093(90)90200-6 ↗
4. Effect of hydroxyl and aldehyde groups on the polishing of silicon dioxide and silicon nitride by cerium oxide dispersions10.1016/j.mssp.2025.109872 ↗
5. Improvement of polishing performance of SiO2/Si3N4 by surfactants in CeO2 based slurry10.1016/j.apsusc.2025.163978 ↗
6. Restricted hydrolysis reaction of Si3N4 via nonionic polymer adsorption in advanced shallow trench isolation chemical mechanical planarization10.1016/j.colsurfa.2023.132716 ↗
7. R. Manivannan, S.N. Victoria, S.J.T.S.F. Ramanathan, Mechanism of high selectivity in ceria based shallow trench isolation chemical mechanical polishing slurries, 518 (2010) 5737–5740.10.1016/j.tsf.2010.05.072 ↗
8. Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process10.1016/j.colsurfa.2022.130668 ↗
9. Shallow trench isolation chemical mechanical planarization: a review10.1149/2.0071511jss ↗
10. Post cleaning for FEOL CMP with silica and ceria slurries10.1149/2.0101710jss ↗
11. Almost complete removal of ceria particles down to 10 nm size from silicon dioxide surfaces10.1149/2.0131805jss ↗
12. Development of eco-friendly cleaning solution for industrial silicon wafer solar cell10.1016/j.mssp.2019.104764 ↗
13. Wet bench reactive hazards of cleaning stages in semiconductor manufacturing processes10.1016/j.jlp.2006.06.002 ↗
14. Removal of nanoceria abrasive particles by using diluted SC1 and non-ionic surfactant10.1149/2162-8777/abedd2 ↗
15. Cleaning solutions for removal of∼ 30 nm ceria particles from proline and citric acid containing slurries deposited on silicon dioxide and silicon nitride surfaces10.1149/2162-8777/ab8ffa ↗
16. Development of a novel wet cleaning solution for post-CMP SiO2 and Si3N4 films10.1016/j.mssp.2021.106353 ↗
17. Effect of viscosity on ceria abrasive removal during the buff clean process10.1149/2162-8777/abb8bc ↗
18. Study on the effect of residual ceria slurry on chemical mechanical planarization (CMP)10.1016/j.mee.2021.111620 ↗
19. Communication—effect of hydrogen water on ceria abrasive removal in post-CMP cleaning10.1149/2162-8777/ab902c ↗
20. A water polishing process to improve ceria abrasive removal10.1149/2.0171908jss ↗
21. Particle removal behavior of micropatterned pad buffing in post-CMP cleaning10.1016/j.mssp.2025.109530 ↗
22. Investigations on the mechanism of silica particle removal during the Cu buff cleaning process10.1016/j.colsurfa.2021.127156 ↗
23. Environmentally friendly buff cleaning of ceria nanoparticles using bubbles in gas-dissolved water10.1016/j.colsurfa.2023.131558 ↗
24. The effect of surfactants on the removal of ceria particles in the buff clean process10.1149/2162-8777/acec97 ↗
25. Effects of gas-dissolved water for ceria nanoparticles on the SiO2 film surface in post-CMP cleaning10.1149/2162-8777/ad4678 ↗
26. A comprehensive electron wavefunction analysis toolbox for chemists, Multiwfn10.1063/5.0216272 ↗
27. Multiwfn: a multifunctional wavefunction analyzer10.1002/jcc.22885 ↗
28. Surface preparation in CMP process; post CMP cleaning and defects10.1149/1.2779406 ↗
29. The London—van der Waals attraction between spherical particles10.1016/S0031-8914(37)80203-7 ↗
30. On Hamaker constants: a comparison between Hamaker constants and Lifshitz-van der Waals constants10.1016/0001-8686(72)85001-2 ↗
31. Munson · 2013 · 271
32. Contamination mechanism of ceria particles on the oxide surface after the CMP process10.1149/2162-8777/abcf13 ↗
33. Study on synergistic mechanism of inhibitor mixture based on electron transfer behavior10.1038/srep33252 ↗
34. The effect of non-ionic surfactants on the removal of cerium oxide particles in STI CMP post cleaning10.1016/j.mssp.2024.108279 ↗
35. Enhanced particle removal ability of two representative nonionic surfactants: a reasonable interpretation based on DFT and coarse-grained molecular dynamics methods10.1016/j.molliq.2024.125984 ↗
36. Role of the oxidation state of cerium on the ceria surfaces for silicate adsorption10.1016/j.apsusc.2016.06.193 ↗
37. Irradiation-induced reactions at the CeO2/SiO2/Si interface10.1063/1.5142619 ↗
38. Effect of preparation methods of CeO2 on the properties and performance of Ni/CeO2 in CO2 reforming of CH410.1038/s41598-022-09291-w ↗
39. Oxygen vacancy clusters promoting reducibility and activity of ceria nanorods10.1021/ja808433d ↗
40. Investigation of the effect of different cleaning forces on Ce–O–Si bonding during oxide post-CMP cleaning10.1016/j.apsusc.2021.149035 ↗
41. Mechanisms of colloidal ceria contamination and cleaning during oxide post CMP cleaning10.1016/j.mee.2021.111544 ↗
42. Developing an efficient forward design method for co post-CMP cleaning formulations based on nanoparticle removal mechanisms10.1021/acsaelm.3c01315 ↗
43. Surface chemistry and tip-sample interactions in atomic force microscopy10.1016/0927-7757(94)02954-Q ↗
44. Characterization of TMAH based cleaning solution for post Cu-CMP application10.1016/j.mee.2012.04.006 ↗
45. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning10.1016/j.mee.2019.111090 ↗
46. Comparison of reactive sites of different conjugated linoleic acid molecules by quantum chemical calculations10.1002/ejlt.202300089 ↗
47. Synthesis, characterization and quantum chemical investigation of molecular structure and vibrational spectra of 2, 5-dichloro-3, 6-bis-(methylamino) 1, 4-benzoquinone10.1016/j.saa.2014.02.082 ↗
48. Electron-rich/poor reaction sites enable ultrafast confining Fenton-like processes in facet-engineered BiOI membranes for water purification10.1016/j.apcatb.2021.120970 ↗
49. A review of the electrophilic reaction chemistry involved in covalent protein binding relevant to toxicity10.3109/10408444.2011.598141 ↗
50. Theoretical determination of a reaction intermediate: Fukui function analysis, dual reactivity descriptor and activation energy10.1016/j.molstruc.2020.129369 ↗
51. Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry10.1016/j.triboint.2024.109832 ↗
52. Three anionic surfactants for corrosion inhibition in cobalt CMP: research on validity and mechanism