journal article·2026-02

Cryogenic atomic layer etching of SiO2 using CH2F2/Ar plasma for improved process window for nanoscale fabrication

Ji Hwan Kim, Jae Hyeon Kim, Gwang Ho Lee, Yu Jin Heo, Ga Eun Hwang, Ye Jun Cheon, Hee Sam Cheon, Yoon Joo Jeong, In Hyeok Kho, Hyo Jong Shin, Chang Hee Lee, In Young Bang, Ranju Jung, Gi-Chung Kwon

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OpenAlex topics: Plasma Diagnostics and Applications · Semiconductor materials and devices · Copper Interconnects and Reliability

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