journal article·2025-12

Complex mechanism of polyamines in copper chemical mechanical polishing: a combined simulation and experimental study

Bowen Luo, Yue He, Baohong Gao, Hailei Zhang, Yadong Zhu

Publisher page

Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

Source: Not provided · Quality: missing

Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Corrosion Behavior and Inhibition · Advanced machining processes and optimization

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (58)

Show source-provided references
1. Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing10.1016/j.apsusc.2020.147109 ↗
2. Evaluating the large electromigration resistance of copper interconnects employing a newly developed accelerated life‐test method10.1149/1.2056211 ↗
3. The Compatibility of Copper CMP Slurries with CMP Requirements10.1149/1.1600465 ↗
4. The effect of TAD based cleaning solution on post Cu CMP process10.1016/j.mee.2016.04.019 ↗
5. Degradation of inhibitor in alkaline cleaning solution for post-Cu CMP cleaning10.1016/j.surfcoat.2018.02.039 ↗
6. M. Yuh, H. Jeong, High-rate CMP Process for Large PCB by Controlling Platen Coolant Temperature, (n.d.).
7. BTA free alkaline slurries developed for copper and barrier CMP10.1149/2.0171511jss ↗
8. Effect of corrosion inhibitor BTA on silica particles and their adsorption on copper surface in copper interconnection CMP10.1149/2162-8777/ac627c ↗
9. S. Park, H. Lee, Electrolytically ionized abrasive-free CMP (EAF-CMP) for copper, Appl. Sci. 11 (2021) 7232. doi: 10.3390/APP11167232.10.3390/app11167232 ↗
10. Microsystems & nanoengineering study on polishing mechanisms of BEOL metal interconnects based on chemical and mechanical synergy10.1038/s41378-025-00883-w ↗
11. B. V Egorova, O.A. Fedorova, S.N. Kalmykov, H.-H. Lo, W.-P. Dow, You may also like Cationic radionuclides and ligands for targeted therapeutic radiopharmaceuticals The Effect of Dual-Chelator on Cu Electroless Deposition Employing Cu Nanoparticles As the Catalyst, (2025). doi: 10.1149/2162-8777/adc59e.10.1149/2162-8777/adc59e ↗
12. Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection10.1016/j.jelechem.2022.116187 ↗
13. Study on adsorption and desorption mechanism of CuO particles on the post-CMP wafer surface of multi-layered copper
14. Green chemistry in chemical mechanical planarization through a comparison of amino acid degradability with benzotriazole in advanced oxidation processes10.1016/j.jece.2024.115134 ↗
15. Slurry components in metal chemical mechanical planarization (CMP) process: a review10.1007/s12541-016-0201-y ↗
16. Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging10.1016/j.apsusc.2025.162466 ↗
17. Material removal mechanism of copper CMP from a chemical-mechanical synergy perspective10.1007/s11249-012-0037-2 ↗
18. Experimental and computational investigation of complexing agents on copper dissolution for chemical mechanical polishing process10.1016/j.colsurfa.2023.131142 ↗
19. Effect of the carboxyl group number of the complexing agent on polishing performance of alumina slurry in sapphire CMP10.1016/j.ceramint.2022.12.246 ↗
20. Role of the functional groups of complexing agents in copper slurries10.1149/1.2199307 ↗
21. An optimized passivation mechanism at the copper film recess for achieving efficient planarization of copper chemical mechanical polishing10.1016/j.mssp.2021.106321 ↗
22. Diethylenetriamine and serine as synergists used in FA/OII based alkaline solution to realize enhanced cleaning efficiency of the organic corrosion inhibitor10.1016/j.colsurfa.2023.131952 ↗
23. Experimental and computational studies on TAD as an additive of copper chemical mechanical polishing
24. Effect of diethylenetriamine pentaacetate pentasodium and guanidine phosphate on chemical mechanical polishing of TSV barrier layer10.1016/j.mseb.2025.117993 ↗
25. Effect of linear aliphatic polyamines on copper removal rate in Chemical Mechanical Planarization (CMP)10.1149/2.0081511jss ↗
26. D.P. Karunaratne, The role of homologous linear polyamines in the chemical mechanical planarization of copper A Thesis, (n.d.).
27. Mechanism exploration of the effect of polyamines on the polishing rate of silicon chemical mechanical polishing: a study combining simulations and experiments10.3390/nano14010127 ↗
28. The study of specific materials used by the copper wiring CMP of GLSI10.4028/www.scientific.net/AMM.307.368 ↗
29. Mechanical aspects of the chemical mechanical polishing process: a review10.1007/s12541-016-0066-0 ↗
30. Insight into Cu(II) adsorption on polyamine resin in the presence of HEDP by tracking the evolution of amino groups and Cu(II)-HEDP complexes10.1021/acssuschemeng.8b06169 ↗
31. Synthesis, crystal structure and properties of polyamine copper(II) complexes10.1007/s11243-005-6380-5 ↗
32. Electrochemical investigation of the surface-modifying roles of guanidine carbonate in chemical mechanical planarization of tantalum10.1016/j.matchemphys.2011.05.079 ↗
33. Study on chemical effects of H2O2 and glycine in the copper CMP process using ReaxFF MD10.1016/j.apsusc.2020.145262 ↗
34. Surface interaction effect and mechanism of methionine derivatives as novel inhibitors for alkaline copper CMP: insights from molecular simulation and experimental analysis10.1149/2162-8777/acf2c2 ↗
35. Unraveling the surface behavior of amino acids on Cu wiring in chemical mechanical polishing of barrier layers: a combination of experiments and ReaxFF MD10.1016/j.molliq.2021.117307 ↗
36. Experimental characterization and dynamical modeling evaluation for enhanced BTA removal by three amino acids in post-Cu-CMP cleaning10.1016/j.molliq.2023.121987 ↗
37. Effect of novel non-inhibitor slurry on chemical mechanical polishing properties of copper interconnect copper film based on experiments and theoretical calculations10.1016/j.colsurfa.2024.135457 ↗
38. Surface corrosion inhibition mechanism of sarcosine as a green novel inhibitor on a novel barrier layer material of cobalt in copper film CMP for GLSI10.1016/j.mssp.2021.106402 ↗
39. Corrosion inhibition threshold effect of 1,2,4-triazole in alkaline chemical mechanical polishing of copper: Investigations using synchrotron radiation microinfrared10.1007/s11581-024-05925-3 ↗
40. Extract preparation of waste lady finger caps using ethanol, generation of extract’s layers on copper through drop casting without and with NiO nanoparticles, and study of their corrosion performances in saline water10.1007/s12649-024-02729-4 ↗
41. Study on the corrosion inhibition of E24 steel in acidic medium by 1,4-benzoxazine derivatives: an approach combining chemistry, electrochemistry, and theoretical modeling10.1016/j.molstruc.2025.141545 ↗
42. Chemistry enhanced shear thickening polishing of Ti–6Al–4V10.1016/j.precisioneng.2021.04.002 ↗
43. Correlations between the inhibition performances and the inhibitor structures of some azoles on the galvanic corrosion of copper coupled with silver in artificial seawater10.1016/j.corsci.2019.108413 ↗
44. Understanding the adsorption and anticorrosive mechanism of DNA inhibitor for copper in sulfuric acid10.1016/j.apsusc.2019.06.190 ↗
45. Analysis, identification, and application of distribution of relaxation times in CMP slurry10.1016/j.electacta.2024.145052 ↗
46. Avoiding common errors in X-ray photoelectron spectroscopy data collection and analysis, and properly reporting instrument parameters10.1016/j.apsadv.2023.100534 ↗
47. CuO by XPS10.1116/1.1247882 ↗
48. Cu2O by XPS10.1116/1.1247881 ↗
49. Cu(OH)2 by XPS10.1116/1.1247883 ↗
50. TPD and XPS studies of O2, CO2, and H2O adsorption on clean polycrystalline graphite10.1016/0008-6223(88)90149-2 ↗
51. Study on enhancement and mechanism of K2SO4 in CMP slurries for copper film polishing removal effect10.1016/j.mssp.2022.107176 ↗
52. Synthesis, crystal structure, DFT study, Hirshfeld surface analysis, molecular docking and antitumor activity of a novel SHP2 inhibitor10.1016/j.molstruc.2023.137320 ↗
53. Molecular electrostatic potential analysis: a powerful tool to interpret and predict chemical reactivity
54. Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: combination of simulation and experiment10.1016/j.colsurfa.2020.124872 ↗
55. Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface10.1016/j.matchemphys.2020.123841 ↗
56. First-principles insight into the pH-dependency of the corrosion inhibition ability of benzotriazole and 1,2,4-triazole for copper in chemical mechanical polishing slurry10.1016/j.corsci.2024.112002 ↗
57. Multidimensional insights into the corrosion inhibition of 3,3-dithiodipropionic acid on Q235 steel in H2SO4 medium: a combined experimental and in silico investigation10.1016/j.jcis.2020.03.001 ↗
58. Molecular dynamics simulation of inhibition mechanism of 3,5-dibromo salicylaldehyde Schiff’s base10.1016/j.comptc.2015.04.003 ↗