Research on the properties of low-k films grafted on Cu (111) surface via electrochemical reduction of aryl diazonium salts
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Semiconductor materials and devices · Copper Interconnects and Reliability · Molecular Junctions and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (86)
Show source-provided references
1. Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
2. Contributing factors of dielectric properties for polymer matrix composites10.3390/polym15030590 ↗
3. Progress in low dielectric polyimide film–A review
4. Ultralow-dielectric-constant amorphous boron nitride10.1038/s41586-020-2375-9 ↗
5. Ultralow dielectric constant polyarylene ether nitrile foam with excellent mechanical properties10.1016/j.cej.2019.123231 ↗
6. Low dielectric constant polymers for high speed communication network
7. Porous organic polymers for electrocatalysis10.1039/D1CS00887K ↗
8. Joshi · 2020 · 41
9. Polyhedral oligomeric silsesquioxanes (POSS)-based hybrid soft gels: Molecular design, material advantages, and emerging applications10.1021/acsmaterialslett.9b00491 ↗
10. Recent advances in hybrid organic-inorganic materials with spatial architecture for state-of-the-art applications10.1016/j.pmatsci.2020.100663 ↗
11. Fabrication and applications of bioactive chitosan-based organic-inorganic hybrid materials: A review10.1016/j.carbpol.2021.118179 ↗
12. Controllable dimensions and regular geometric architectures from self-assembly of lithium-containing polyhedral oligomeric silsesquioxane: Build for enhancing the fire safety of epoxy resin10.1016/j.compositesb.2021.109483 ↗
13. High performance POSS filled nanocomposites prepared via UV-curing based on 3D stereolithography printing10.1016/j.compositesa.2018.11.024 ↗
14. Chemically crosslinked polyimide-POSS hybrid: A dielectric material with improved dimensional stability and dielectric properties10.1016/j.eurpolymj.2022.111315 ↗
15. Sustainable in situ approach to covalently functionalize graphene oxide with POSS molecules possessing extremely low dielectric behavior10.1021/acs.langmuir.9b00028 ↗
16. Surface-grafting polymers: from chemistry to organic electronics10.1039/C9QM00450E ↗
17. Flexible organic transistors for biosensing: devices and applications10.1002/adma.202300034 ↗
18. Covalent grafting of dielectric films on Cu (111) surface via electrochemical reduction of aryl diazonium salts10.1021/acs.langmuir.2c02740 ↗
19. One-step dipping method for covalently grafting polymer films onto a Si surface from aqueous media10.1021/acs.langmuir.6b01931 ↗
20. Covalent grafting of tethered homopolymer film on p-Si (100)10.1021/acs.langmuir.6b00343 ↗
21. Advanced capabilities for materials modelling with Quantum ESPRESSO10.1088/1361-648X/aa8f79 ↗
22. Rationale for mixing exact exchange with density functional approximations10.1063/1.472933 ↗
23. Conditioning of quasi-Newton methods for function minimization10.1090/S0025-5718-1970-0274029-X ↗
24. Semiempirical GGA-type density functional constructed with a long-range dispersion correction10.1002/jcc.20495 ↗
25. VESTA 3 for three-dimensional visualization of crystal, volumetric and morphology data10.1107/S0021889811038970 ↗
26. Adsorption and decomposition of ZDDP on lightweight metallic substrates: Ab initio and experimental insights10.1016/j.apsusc.2022.153947 ↗
27. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art. Applied
28. Beyne E. Cu interconnects and low-k dielectrics, Challenges for chip interconnections and packaging; proceedings of the Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat No 03TH8695), F, 2003 [C]. IEEE.
29. Integration of Low Dielectric Constant Materials in Advanced Aluminum and Copper Interconnects10.1557/PROC-564-485 ↗
30. Interconnect limits on gigascale integration (GSI) in the 21st century10.1109/5.915376 ↗
31. A monolithic micro-tensile tester for investigating silicon dioxide polymorph micromechanics, fabricated and operated using a femtosecond laser10.3390/mi6091365 ↗
32. Bansal · 2013
33. Xin K, Lambropoulos J C. Densification of fused silica: effects on nanoindentation; proceedings of the Inorganic Optical Materials II, F, 2000 [C]. SPIE.10.1117/12.405275 ↗
34. Mechanical characterization of a polysiloxane-derived SiOC glass10.1016/j.jeurceramsoc.2006.01.016 ↗
35. What is the Young's Modulus of Silicon?10.1109/JMEMS.2009.2039697 ↗
36. Young’s modulus, residual stress, and crystal orientation of doubly clamped silicon nanowire beams10.1021/nl5047939 ↗
37. A simple guide to determine elastic properties of films on substrate from nanoindentation experiments10.1080/14786430600660856 ↗
38. Effect of montmorillonite addition on mechanical characterizations of polyimide nanocomposite films
39. Dominant role of Young’s modulus for electric power generation in PVDF–BaTiO3 composite-based piezoelectric nanogenerator10.3390/nano8100777 ↗
40. Lichtenhan J D, Pielichowski K, Blanco I. POSS-based polymers [Z]. MDPI. 2019: 1727.10.3390/polym11101727 ↗
41. Enhancing the permeation flux and antifouling performance of polyamide nanofiltration membrane by incorporation of PEG-POSS nanoparticles10.1016/j.memsci.2017.06.084 ↗
42. POSS and fluorine containing nanostructured block copolymer; Synthesis via RAFT polymerization and its application as hydrophobic coating material10.1016/j.eurpolymj.2020.109679 ↗
43. Polyurethane networks modified with octa (propylglycidyl ether) polyhedral oligomeric silsesquioxane10.1002/macp.200600241 ↗
44. Polyurethane/POSS nanocomposites for superior hydrophobicity and high ductility10.1016/j.compositesb.2019.107441 ↗
45. Relationship between water absorption and dielectric behaviour of natural fibre composite materials10.1016/j.polymertesting.2005.11.002 ↗
46. Volume change behaviour of swelling and non-swelling clays upon inundation with water and a low dielectric constant fluid10.1016/j.clay.2018.03.031 ↗
47. An ultrasensitive near-infrared ratiometric fluorescent probe for imaging mitochondrial polarity in live cells and in vivo10.1039/C5SC04099J ↗
48. Dielectric constants of some organic solvent-water mixtures at various temperatures10.1021/ja01350a001 ↗
49. Practical applications of superhydrophobic materials and coatings: problems and perspectives10.1021/acs.langmuir.9b03908 ↗
50. Superhydrophobic and superoleophobic properties in nature10.1016/j.mattod.2015.01.001 ↗
51. Low dielectric constant materials for microelectronics10.1063/1.1567460 ↗
52. Fluorographene/polyimide composite films: mechanical, electrical, hydrophobic, thermal and low dielectric properties10.1016/j.compositesa.2016.02.019 ↗
53. Polymer-based low dielectric constant and loss materials for high-speed communication network: Dielectric constants and challenges
54. Impact of VUV photons on SiO2 and organosilicate low-k dielectrics: General behavior, practical applications, and atomic models. Applied
55. Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration10.1021/acs.chemrev.3c00802 ↗
56. Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material10.1016/S0167-9317(96)00061-5 ↗
57. Chemical-mechanical polishing of polymer films: Comparison of benzocyclobutene (BCB) and parylene-N films by XPS and AFM10.1557/PROC-476-161 ↗
58. Low dielectric constant polymers for on-chip interlevel dielectrics with copper metallization10.1557/PROC-381-177 ↗
59. Low dielectric constant polymers for microelectronics10.1016/S0079-6700(00)00043-5 ↗
60. Synthesis of fluorinated polyimides [M]
61. Ghosh · 2018
62. Synthesis and characterization of fluorinated poly (arylethers): organic polymers for IC IMD10.1557/PROC-381-59 ↗
63. SiLK polymer coating with low dielectric constant and high thermal stability for ULSI interlayer dielectric10.1557/PROC-476-9 ↗
64. Bokuniaeva A, Vorokh A. Estimation of particle size using the Debye equation and the Scherrer formula for polyphasic TiO2 powder; proceedings of the journal of physics: Conference series, F, 2019 [C]. IOP Publishing.10.1088/1742-6596/1410/1/012057 ↗
65. Determination of interface layer thickness of a pseudo two-phase system by extension of the Debye equation10.1088/0022-3727/34/14/301 ↗
66. Low-k dielectric materials10.1016/S1369-7021(04)00053-7 ↗
67. Low dielectric constant materials10.1021/cr9002819 ↗
68. The effect of incorporation of POSS units on polymer blend compatibility10.1002/app.31225 ↗
69. Morphology of blends containing high concentrations of POSS nanoparticles in different polymer matrices10.1002/pen.21612 ↗
70. Intercalation: constructing nanolaminated reduced graphene oxide/silica ceramics for lightweight and mechanically reliable electromagnetic interference shielding applications10.1021/acsami.0c15193 ↗
71. Skeletal density of silica aerogels determined by helium pycnometry10.1007/BF01142014 ↗
72. Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides10.1016/0032-3861(87)90388-0 ↗
73. Fundamental limits to the refractive index of transparent optical materials10.1002/adma.202103946 ↗
74. On the theory of dielectric polarization10.1063/1.1749911 ↗
75. Dielectric polymers with novel chemistry, compositions and architectures10.1016/j.progpolymsci.2018.01.003 ↗
76. Interface design and dielectric response behavior of SiO2/PB composites with low dielectric constant and ultra-low dielectric loss
77. Novel polyethersulfone dielectric films with high temperature resistance, intrinsic low dielectric constant and low dielectric loss10.1007/s10854-020-04873-8 ↗
78. The role of the dielectric loss of dispersed material in the electrorheological effect10.1063/1.118790 ↗
79. Dielectric polymers [M]10.1007/978-3-319-95987-0_8 ↗
80. Rigden · 1996 · 353
81. College physics
82. Rubber Bible Turns 6010.1126/science.204.4398.1181 ↗
83. Elert G. The physics hypertextbook . Found July, 1998, 9(2008): 6.
84. Electronic properties of diamond [D]
85. A novel cross-linked polyimide film: synthesis and dielectric properties10.1016/j.polymer.2005.02.097 ↗
86. Structural, optical and electronic properties of CuO and Zn doped CuO: DFT based First-principles calculations10.1016/j.chemphys.2019.110536 ↗