Design of surface topography for fabricating nanotwinned copper/polyimide hybrid joints using in-situ heating atomic force microscopy
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OpenAlex topics: Force Microscopy Techniques and Applications · Nanofabrication and Lithography Techniques · Advanced Surface Polishing Techniques
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References (46)
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1. Recent Advances and Trends in Cu–Cu Hybrid Bonding10.1109/TCPMT.2023.3265529 ↗
2. Method for room temperature metal direct bonding, Adeia Semiconductor Bonding Technologies Inc
3. Y. Kagawa, N. Fujii, K. Aoyagi, Y. Kobayashi, S. Nishi, N. Todaka, S. Takeshita, J. Taura, H. Takahashi, Y. Nishimura, Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding, 2016 IEEE International Electron Devices Meeting (IEDM), IEEE, 2016, pp. 8.4. 1-8.4. 4.10.1109/IEDM.2016.7838375 ↗
4. Y. Kagawa, T. Kamibayashi, Y. Yamano, K. Nishio, A. Sakamoto, T. Yamada, K. Shimizu, T. Hirano, H. Iwamoto, Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding, in: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), IEEE, 2022, pp. 306-311.10.1109/ECTC51906.2022.00057 ↗
5. Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub- μm Pitch Devices with Enhanced Bonding Characteristics
6. Influence of Composition of SiCN as interfacial layer on plasma activated direct bonding10.1149/2.0241906jss ↗
7. S.-W. Kim, F. Fodor, N. Heylen, S. Iacovo, J. De Vos, A. Miller, G. Beyer, E. Beyne, Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), IEEE, 2020, pp. 216-222.10.1109/ECTC32862.2020.00046 ↗
8. S. Yoneda, K. Adachi, K. Kobayashi, D. Matsukawa, M. Sasaki, T. Itabashi, T. Shirasaka, T. Shibata, A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 680-686.10.1109/ECTC32696.2021.00118 ↗
9. M. Aoki, K. Hozawa, K. Takeda, Wafer-level hybrid bonding technology with copper/polymer co-planarization, 2010 IEEE International 3D Systems Integration Conference (3DIC), IEEE, 2010, pp. 1-4.10.1109/3DIC.2010.5751471 ↗
10. Wafer-to-wafer hybrid bonding technology for 3D IC, 3rd electronics system integration technology conference ESTC
11. V. Chidambaram, P. Lianto, X. Wang, G. See, N. Wiswell, M. Kawano, Dielectric Materials Characterization for Hybrid Bonding, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 426-431.10.1109/ECTC32696.2021.00078 ↗
12. Lee · 2023
13. Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices10.1002/admt.202202134 ↗
14. Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration10.1109/TED.2019.2915332 ↗
15. Interfacial characterization of low-temperature Cu-to-Cu direct bonding with chemical mechanical planarized nanotwinned Cu films10.3390/ma15030937 ↗
16. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper10.1126/science.1216511 ↗
17. Low-Temperature Photosensitive Polyimide Processing for Use in 3D Integration Technologies10.1557/opl.2014.520 ↗
18. Thermal imidization process of polyimide film: Interplay between solvent evaporation and imidization10.1016/j.polymer.2016.12.037 ↗
19. Measurements of linear thermal expansion coefficients of copper SRM 736 and some commercially available coppers in the temperature range 20–300 K by means of an absolute interferometric dilatometer10.1016/S0011-2275(97)00010-6 ↗
20. Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process using Finite Element Analysis
21. Predicting trends in rate parameters for self-diffusion on FCC metal surfaces10.1016/S0039-6028(02)01916-7 ↗
22. A kinetic model of copper-to-copper direct bonding under thermal compression10.1016/j.jmrt.2021.09.071 ↗
23. Tai · 1999
24. Effect of non-ionic surfactant on copper dishing and dielectric erosion correction in alkaline barrier CMP solution free of inhibitors10.1149/2.0191705jss ↗
25. Bhushan · 2008
26. Frequency modulation detection using high‐Q cantilevers for enhanced force microscope sensitivity10.1063/1.347347 ↗
27. Calculation of the optimal imaging parameters for frequency modulation atomic force microscopy10.1016/S0169-4332(98)00553-4 ↗
28. Effect of thermal history on the deformation and failure of polyimides10.1002/polb.10043 ↗
29. Influence of the viscoelastic properties of the polyimide dielectric coating on the wafer warpage10.1007/s11664-014-3255-6 ↗
30. Curing of polyimides10.1002/pen.760290514 ↗
31. Stress behaviors and thermal properties of polyimide thin films depending on the different curing process10.1002/1099-0488(20001115)38:22<2879::AID-POLB30>3.0.CO;2-A ↗
32. Z. Karim, K. Sautter, K. Song, C. Galande, K. Singh, Cure Process Impact on Cure Time and Properties of Low Temperature Polyimide for 3D Stacking Applications, 2020 International Wafer Level Packaging Conference (IWLPC), IEEE, 2020, pp. 1-6.10.23919/IWLPC52010.2020.9375874 ↗
33. High-bonding-strength polyimide films achieved via thermal management and surface activation10.3390/nano13091575 ↗
34. The effect of polyimide passivation on the electromigration of Cu multilayer interconnections
35. Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
36. In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures
37. Size-and phase-dependent mechanical properties of ultrathin Si films on polyimide substrates10.1016/j.actamat.2016.03.028 ↗
38. Synthesis of superheat-resistant polyimides with high T g and low coefficient of thermal expansion by introduction of strong intermolecular interaction10.1021/acs.macromol.8b02282 ↗
39. Thermal expansion behavior of polyimide films containing benzoxazole unit10.1177/0954008313517250 ↗
40. Anisotropic Linear and Volumetric Thermal‐Expansion Behaviors of Self‐Standing Polyimide Films Analyzed by Thermomechanical Analysis (TMA) and Optical Interferometry10.1002/macp.201700354 ↗
41. Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films10.3390/polym9090451 ↗
42. Thermal effects under elastic and plastic deformation of polyethylene10.1016/j.polymer.2014.11.041 ↗
43. Post-Processing Time Dependence of Shrinkage and Mechanical Properties of Injection-Molded Polypropylene10.3390/ma14010022 ↗
44. Fabrication of a bilayer structure of cu and polyimide to realize circuit microminiaturization and high interfacial adhesion in flexible electronic devices10.1021/acsami.8b15835 ↗
45. Influence of bond coat on shear adhesion strength of erosion and thermal resistant coating for carbon fiber reinforced thermosetting polyimide10.1016/j.surfcoat.2006.05.012 ↗
46. Bonding at symmetric polymer/polymer interfaces below the glass transition temperature10.1021/ma960002x ↗