Modifying wetting properties of PI Film: The impact of surface texturing and CF4 and O2 plasma treatment
Source abstract
Abstract
Polyimide (PI) is a versatile polymer widely used in various industries because of its excellent heat and chemical resistance, and structural properties. This study presents an effective method for modifying the surface properties of PI films using a combination of laser-induced surface texturing and low-pressure CF 4 and O 2 plasma treatments. Post plasma treatment and surface texturing, the polyimide (PI) films exhibited enhanced hydrophobicity , as indicated by an increased contact angle from 82.4 ± 0.8 degrees to 143.6 ± 2.2 degrees, and a reduced surface free energy from 45.0 ± 0.3 mN/m to 1.4 ± 0.3 mN/m. The friction force between water droplets and the treated PI films decreased by approximately 30 %, indicating a significant improvement in the wetting properties. Surface characterization with X-ray photoelectron spectroscopy (XPS) analysis confirmed the successful introduction of new fluorine-containing groups and an increase in the extent of C = O bonds. Importantly, the plasma gas treatment resulted in a significant decrease in bacterial attachment, demonstrating its potential for reducing biofouling.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Surface Modification and Superhydrophobicity · Adhesion, Friction, and Surface Interactions · Advanced Sensor and Energy Harvesting Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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