journal article·2025-03

Densification mechanism and surface mechanical failure evolution of complex silver nanoparticle interconnection interface via pressure-assisted forced bonding

Weishan Lv, Zexiang Zheng, Baihan Liu, Jianwei Lv, Jiaxin Liu, Cai Chen, Yong Kang

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OpenAlex topics: Nanomaterials and Printing Technologies · Nanofabrication and Lithography Techniques · Electronic Packaging and Soldering Technologies

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